Semiconductor device

ABSTRACT

A semiconductor device  1  includes a first drain terminal  4 , connected to a drain electrode of a first semiconductor chip, a first gate terminal  5 , connected to a gate electrode of the first semiconductor chip, a second drain terminal  6 , connected to a drain electrode of a second semiconductor chip, a second gate terminal  7 , connected to a gate electrode of the second semiconductor chip, a common source terminal  8 , connected to a source electrode of the first semiconductor chip and a source electrode of the second semiconductor chip, and a sealing resin  9 , sealing the respective semiconductor chips and the respective terminals. The respective terminals have exposed surfaces (lower surfaces)  43, 53, 63, 73 , and  83  substantially flush with an outer surface (lower surface)  9   b  of the sealing resin  9  and exposed from the outer surface  9   b.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a semiconductor device that can be usedas a bidirectional switch.

2. Description of the Related Art

As a semiconductor device, there is known a semiconductor device(hereinafter referred to as “conventional semiconductor device”) thatincludes a first semiconductor chip, constituted of a MOSFET, a secondsemiconductor chip, constituted of a MOSFET, a first drain terminal, afirst source terminal, a first gate terminal, a second drain terminal, asecond source terminal, and a second gate terminal. The first drainterminal, the first source terminal, and the first gate terminal areelectrically connected to a drain electrode, a source and a gateelectrode, respectively of the first semiconductor chip. The seconddrain terminal, the second source terminal, and the second gate terminalare electrically connected to a drain electrode, a source and a gateelectrode, respectively of the second semiconductor chip.

SUMMARY OF THE INVENTION

The inventor of preferred embodiments of the present invention describedand claimed in the present application conducted an extensive study andresearch regarding a semiconductor device, such as the one describedabove, and in doing so, discovered and first recognized new uniquechallenges and previously unrecognized possibilities for improvements asdescribed in greater detail below.

If the conventional semiconductor device is to be used as abidirectional switch with an arrangement where two MOSFETs are connectedback-to-back, the source terminal of the first semiconductor chip andthe source terminal of the second semiconductor chip must be connectedvia a connecting member at an exterior of the semiconductor device.

An object of the present invention is to provide a semiconductor devicewhich, in use as a bidirectional switch, does not require the sourceterminal of the first semiconductor chip and the source terminal of thesecond semiconductor chip to be connected externally and enablesminiaturization.

In order to overcome the previously unrecognized and unsolved challengesdescribed above, a preferred embodiment of the present inventionprovides a semiconductor device. A preferred embodiment of the presentinvention provides a semiconductor device. The semiconductor deviceincludes a first semiconductor chip, constituted of a MOSFET, a secondsemiconductor chip, constituted of a MOSFET, a first drain terminal,electrically connected to a drain electrode of the first semiconductorchip, a first gate terminal, electrically connected to a gate electrodeof the first semiconductor chip, a second drain terminal, electricallyconnected to a drain electrode of the second semiconductor chip, asecond gate terminal, electrically connected to a gate electrode of thesecond semiconductor chip, a common source terminal, electricallyconnected to a source electrode of the first semiconductor chip and asource electrode of the second semiconductor chip, and a sealing resin,sealing the respective semiconductor chips and the respective terminals,and each of the terminals has an exposed surface substantially flushwith an outer surface of the sealing resin and exposed from the outersurface.

With the present semiconductor device, the source electrode of the firstsemiconductor chip and the source electrode of the second semiconductorchip are electrically connected to the common source terminal.Therefore, when the present semiconductor device is used as abidirectional switch, there is no need to connect the source electrodeof the first semiconductor chip and the source electrode of the secondsemiconductor chip at an exterior of the semiconductor device.

Also with the present semiconductor device, each terminal has theexposed surface that is substantially flush with the outer surface ofthe sealing resin and exposed from the outer surface and thereforeminiaturization can be achieved in comparison to a semiconductor devicehaving lead terminals projecting from the outer surface of the sealingresin.

In the preferred embodiment of the present invention, the sealing resinhas two opposing surfaces and a side surface joining the surfaces.

In the preferred embodiment of the present invention, the exposedsurface of each terminal includes a first exposed surface substantiallyflush with one surface of the two surfaces of the sealing resin andexposed from the one surface.

In the preferred embodiment of the present invention, the exposedsurface of each terminal further includes a second exposed surface,continuous to the first exposed surface of the terminal, substantiallyflush with the side surface of the sealing resin and exposed from theside surface.

In the preferred embodiment of the present invention, the sealing resinis of rectangular parallelepiped shape with plan view shapes of the twosurfaces being rectangular and the side surface includes four sidesurfaces joining opposing sides of the two surfaces to each other.

In the preferred embodiment of the present invention, the one surface ofthe sealing resin has a first side and a second side that are mutuallyopposed, a third side joining one ends of the first side and the secondside together, and a fourth side joining other ends of the first sideand the second side together, the first exposed surface of the firstdrain terminal is disposed at a first corner portion at which the firstside and the third side of the one surface are joined, and the firstexposed surface of the second drain terminal is disposed at a secondcorner portion at which the first side and the fourth side of the onesurface are joined. Also, the first exposed surface of the first gateterminal is disposed at a third corner portion at which the second sideand the third side of the one surface are joined, and the first exposedsurface of the second gate terminal is disposed at a fourth cornerportion at which the second side and the fourth side of the one surfaceare joined. The first exposed surface of the common source terminal isdisposed at an intermediate position of the one surface between thefirst exposed surface of the first gate terminal and the first exposedsurface of the second gate terminal.

In the preferred embodiment of the present invention, the first exposedsurface of each terminal has a rectangular shape having four sidesparallel to the four sides of the one surface. And if, with the firstexposed surface of each drain terminal, a length of the side parallel tothe first side is LD1 and a length of the side parallel to the thirdside is LD2, and with the first exposed surface of each gate terminal, alength of the side that is parallel to the first side is LG1 and alength of the side parallel to the third side is LG2, and with the firstexposed surface of the source terminal, a length of the side that isparallel to the first side is LS1 and a length of the side parallel tothe third side is LS2, and an interval, along a direction along thefirst side, between the first exposed surface of the first drainterminal and the first exposed surface of the second drain terminal isd1, an interval, along a direction along the second side, between thefirst exposed surface of the first gate terminal and the first exposedsurface of the common source terminal is d2, an interval, along thedirection along the second side, between the first exposed surface ofthe second gate terminal and the first exposed surface of the commonsource terminal is d3, an interval, along a direction along the thirdside, between the first exposed surface of the first drain terminal andthe first exposed surface of the first gate terminal is d4, and aninterval, along a direction along the fourth side, between the firstexposed surface of the second drain terminal and the first exposedsurface of the second gate terminal is d5, the following formulae (a)and (b) are established.d1=d2=d3=d4=d5  (a)LS2=LG2  (b)

In the preferred embodiment of the present invention, the followingformulae (c) to (f) are further established.LS1=d1  (c)LD2=LD1  (d)LG2=LG1  (e)LD1>LG1  (f)

In the preferred embodiment of the present invention, a sum of an areaof the first exposed surface of the first drain terminal and an area ofthe first exposed surface of the second drain terminal is ¼ to ⅜ of anarea of an entirety of the one surface of the sealing resin.

In the preferred embodiment of the present invention, a sum of an areaof the first exposed surface of the first drain terminal, an area of thefirst exposed surface of the second drain terminal, an area of the firstexposed surface of the first gate terminal, an area of the first exposedsurface of the second gate terminal, and an area of the first exposedsurface of the common source terminal is ⅓ to 11/24 of an area of anentirety of the one surface of the sealing resin.

In the preferred embodiment of the present invention, the first exposedsurface of each of the first drain terminal, the second drain terminal,the first gate terminal, and the second gate terminal has, in plan view,a quadrilateral shape having a fifth side and a sixth side, matching twosides of a corner portion of the sealing resin at which the exposedsurface is disposed, and a seventh side and an eighth side, with oneends connected to the fifth side and sixth side, respectively, and otherends connected to each other, and a connection portion of the seventhside and the eighth side is formed to a curved shape projecting outwardof the first exposed surface.

In the preferred embodiment of the present invention, the first exposedsurface of the common source terminal has, in plan view, a quadrilateralshape having a ninth side matching the second side of the one surface ofthe sealing resin, a tenth side and an eleventh side, with one endsrespectively connected to respective ends of the ninth side, and atwelfth side, connecting the tenth side and the eleventh side, and aconnection portion of the tenth side and the twelfth side and aconnection portion of the eleventh side and the twelfth side are formedto curved shapes projecting outward of the first exposed surface.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an illustrative perspective view of a semiconductor deviceaccording to a first preferred embodiment of the present invention.

FIG. 2 is an illustrative plan view of FIG. 1.

FIG. 3 is an illustrative front view of FIG. 1.

FIG. 4 is an illustrative rear view of FIG. 1.

FIG. 5 is an illustrative left side view of FIG. 1.

FIG. 6 is an illustrative right side view of FIG. 1.

FIG. 7 is an illustrative bottom view of FIG. 1.

FIG. 8 is a plan view of an internal structure.

FIG. 9 is a sectional view taken along line IX-IX of FIG. 8.

FIG. 10 is a sectional view taken along line X-X of FIG. 8.

FIG. 11 is a sectional view taken along line XI-XI of FIG. 8.

FIG. 12 is a sectional view, corresponding to the sectional view of FIG.9, of a mounted state of the semiconductor device of FIG. 1.

FIG. 13 is a sectional view, corresponding to the sectional view of FIG.10, of the mounted state of the semiconductor device of FIG. 1.

FIG. 14 is an electric circuit diagram of an electric circuit of abidirectional switch realized by the semiconductor device of FIG. 1.

FIG. 15 is a circuit diagram for describing an example of use of thebidirectional switch of FIG. 14.

FIG. 16 is an illustrative perspective view of a semiconductor deviceaccording to a second preferred embodiment of the present invention.

FIG. 17 is an illustrative plan view of FIG. 16.

FIG. 18 is an illustrative front view of FIG. 16.

FIG. 19 is an illustrative rear view of FIG. 16.

FIG. 20 is an illustrative left side view of FIG. 16.

FIG. 21 is an illustrative right side view of FIG. 16.

FIG. 22 is an illustrative bottom view of FIG. 16.

FIG. 23 is a plan view of an internal structure.

FIG. 24 is a sectional view taken along line XXIV-XXIV of FIG. 23.

FIG. 25 is a sectional view taken along line XXV-XXV of FIG. 23.

FIG. 26 is a sectional view taken along line XXVI-XXVI of FIG. 23.

FIG. 27 is a sectional view, corresponding to the sectional view of FIG.24, of a mounted state of the semiconductor device of FIG. 16.

FIG. 28 is a sectional view, corresponding to the sectional view of FIG.25, of the mounted state of the semiconductor device of FIG. 16.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Preferred embodiments of the present invention shall now be described indetail with reference to the attached drawings.

FIG. 1 is an illustrative perspective view of a semiconductor deviceaccording to a first preferred embodiment of the present invention. FIG.2 is an illustrative plan view of FIG. 1. FIG. 3 is an illustrativefront view of FIG. 1. FIG. 4 is an illustrative rear view of FIG. 1.FIG. 5 is an illustrative left side view of FIG. 1. FIG. 6 is anillustrative right side view of FIG. 1. FIG. 7 is an illustrative bottomview of FIG. 1. FIG. 8 is a plan view of an internal structure. FIG. 9is a sectional view taken along line IX-IX of FIG. 8. FIG. 10 is asectional view taken along line X-X of FIG. 8. FIG. 11 is a sectionalview taken along line XI-XI of FIG. 8.

The semiconductor device 1 shown in FIG. 1 to FIG. 11 is a devicearranged to realize a bidirectional switch 100 represented by anelectric circuit such as shown in FIG. 14. The bidirectional switch 100includes a first MOSFET 101 and a second MOSFET 102 that are connectedback-to-back (back-to-back connection). In the example of FIG. 1, eachof the MOSFETs 101 and 102 is an n channel type MOSFET. The first MOSFET101 has a first parasitic diode 111. The first parasitic diode 111 isantiparallel-connected to the first MOSFET 101. Specifically, an anodeof the first parasitic diode 111 is connected to a source of the firstMOSFET 101, and a cathode of the first parasitic diode 111 is connectedto a drain of the first MOSFET 101.

The second MOSFET 102 includes a second parasitic diode 112. The secondparasitic diode 112 is antiparallel-connected to the second MOSFET 102.Specifically, an anode of the second parasitic diode 112 is connected toa source of the second MOSFET 102, and a cathode of the second parasiticdiode 112 is connected to a drain of the second MOSFET 102.

The source of the first MOSFET 101 is connected to the source of thesecond MOSFET 102. That is, the source of the first MOSFET 101 and thesource of the second MOSFET 102 are serially connected (back-to-backconnected) such that directions of the first parasitic diode 111 and thesecond parasitic diode 112 are opposite.

The bidirectional switch 100 includes a first drain terminal 4,connected to a drain electrode of the first MOSFET 101, and a first gateterminal 5, connected to a gate electrode of the first MOSFET 101. Thebidirectional switch 100 also includes a second drain terminal 6,connected to a drain electrode of the second MOSFET 102, and a secondgate terminal 7, connected to a gate electrode of the second MOSFET 102.The bidirectional switch 100 further includes a common source terminal 8connected to a source electrode of the first MOSFET 101 and a sourceelectrode of the second MOSFET 102.

When a gate signal applied to the first gate terminal 5 and the secondgate terminal 7 is set to an active level, the first and second MOSFETs101 and 102 are turned on and it thus becomes possible to make a currentflow bidirectionally between the first drain terminal 4 and the seconddrain terminal 6. When the gate signal applied to the first gateterminal 5 and the second gate terminal 7 is set to an inactive level,the first and second MOSFETs 101 and 102 are turned off. The parasiticdiodes 111 and 112 are connected so as to be mutually opposite indirection and therefore in the state where the first and second MOSFETs101 and 102 are off, the bidirectional flow of current is prevented.

Such a bidirectional switch 100 is, for example, provided in a powersupply portion 130 inside a notebook type PC as shown in FIG. 15.Specifically, one drain terminal 6 of the bidirectional switch 100 isconnected to a battery 121. The other drain terminal 4 of thebidirectional switch 100 is connected to a DC input terminal 122 and aninternal circuit 123. The gate signal of the bidirectional switch 100 iscontrolled by a controller 124. When the gate signal of thebidirectional switch 100 is set to the active level, the bidirectionalswitch 100 is turned on and the battery 121 is connected to the DC inputterminal 122 and the internal circuit 123. When the gate signal of thebidirectional switch 100 is set to the inactive level, the bidirectionalswitch 100 is turned off and the battery 121 is disconnected from the DCinput terminal 122 and the internal circuit 123.

The semiconductor device 1 shall now be described in detail withreference to FIG. 1 to FIG. 11. In the following description, up shallrefer to an upper side of the paper surface of FIG. 3 (front view), downshall refer to a lower side of the paper surface of FIG. 3, left shallrefer to a left side of the paper surface of FIG. 3, right shall referto a right side of the paper surface of FIG. 3, front shall refer to alower side of the paper surface of FIG. 2 (plan view), and rear shallrefer to an upper side of the paper surface of FIG. 2. FIG. 1 shows anappearance of the semiconductor device 1 in a state where a bottomsurface (lower surface) is disposed to face upward. In FIG. 1, a rearsurface (rear side surface) of the semiconductor device 1 faces forwardand a front surface (front side surface) of the semiconductor device 1faces rearward.

Mainly referring to FIG. 1 and FIG. 8 to FIG. 11, the semiconductordevice 1 includes a first semiconductor chip 2, functioning as the firstMOSFET 101 of FIG. 14, a second semiconductor chip 3, functioning as thesecond MOSFET 102 of FIG. 14, the first drain terminal 4, the first gateterminal 5, the second drain terminal 6, the second gate terminal 7, thecommon source terminal 8, first to fourth bonding wires (metalconnecting members) 11 to 14, and a sealing resin 9.

The first semiconductor chip 2 is die-bonded on the first drain terminal4 in a state where a surface (device forming surface), at a side atwhich a functional element is formed, is faced upward. A drain electrodeis formed at a bottom surface (lower surface) of the first semiconductorchip 2. The drain electrode of the first semiconductor chip 2 ismechanically and electrically connected to an upper surface of the firstdrain terminal 4.

A source electrode (source pad) 2S and a gate electrode (gate pad) 2G(see FIG. 8) are formed on a top surface (upper surface) of the firstsemiconductor chip 2. The source electrode 2S is connected to the commonsource terminal 8 by the bonding wire 11. The gate electrode 2G isconnected to the first gate terminal 5 by the bonding wire 12.

The second semiconductor chip 3 is die-bonded on the second drainterminal 6 in a state where a surface (device forming surface), at aside at which a functional element is formed, is faced upward. A drainelectrode is formed at a bottom surface (lower surface) of the secondsemiconductor chip 3. The drain electrode of the second semiconductorchip 3 is mechanically and electrically connected to an upper surface ofthe second drain terminal 6.

A source electrode (source pad) 3S and a gate electrode (gate pad) 3G(see FIG. 8) are formed on a top surface (upper surface) of the secondsemiconductor chip 3. The source electrode 3S is connected to the commonsource terminal 8 by the bonding wire 13. The gate electrode 3G isconnected to the second gate terminal 7 by the bonding wire 14. Therespective terminals 4 to 8 are formed from metal thin platesconstituted of copper or an alloy that contains copper.

The sealing resin 9 is constituted, for example, of an epoxy resin. Asshown in FIG. 1, the sealing resin 9 is formed, for example, to asubstantially rectangular parallelepiped shape that is flat in avertical direction. The vertical direction is synonymous to a thicknessdirection of the semiconductor device 1. The sealing resin 9 ofsubstantially rectangular parallelepiped shape has an upper surface 9 a,constituting a top surface, a lower surface 9 b, constituting a bottomsurface, and side surfaces 9 c to 9 f extending in substantiallyperpendicular directions with respect to the upper surface 9 a and thelower surface 9 b. The upper surface 9 a and the lower surface 9 b areboth flat surfaces.

The upper surface 9 a and the lower surface 9 b are formed torectangular shapes that are long in a right/left direction in plan view.The side surfaces 9 c to 9 f are continuous to the upper surface 9 a andthe lower surface 9 b. In detail, the side surfaces 9 c to 9 f areformed over an entire periphery, excluding the upper surface 9 a and thelower surface 9 b, of the semiconductor device 1. In other words, thesemiconductor device 1 has the four side surfaces 9 c to 9 f that arecontinuous to respective four sides of the upper surface 9 a and thelower surface 9 b. The four side surface 9 c to 9 f are constituted ofthe front side surface 9 c, the left side surface 9 d, the rear sidesurface 9 e, and the right side surface 9 f.

As shown in FIG. 8, when an interior of the sealing resin 9 is viewedfrom a plane, the first drain terminal 4 is disposed at a left rearwardcorner portion, the second drain terminal 6 is disposed at a rightrearward corner portion, the first gate terminal 5 is disposed at a leftforward corner portion, the second gate terminal 7 is disposed at aright forward corner portion, and the common source terminal 8 isdisposed at a position between the first gate terminal 5 and the secondgate terminal 7.

Referring to FIG. 1, FIG. 8, and FIG. 9, the first drain terminal 4 has,integrally, a terminal main body portion 41 of rectangularparallelepiped shape having a rectangular bottom surface shape, and aterminal detachment restraining portion 42. The terminal main bodyportion 41 has a lower surface 43, an upper surface 44, positioned at anopposite side to the lower surface 43, and four side surfaces 45,connecting the lower surface 43 and the upper surface 44. The lowersurface 43 of the terminal main body portion 41 is substantially flushwith the lower surface 9 b of the sealing resin 9 and is exposed fromthe lower surface 9 b. That is, the lower surface 43 of the terminalmain body portion 41 constitutes a first exposed surface of the firstdrain terminal 4. In bottom view (plan view), the terminal main bodyportion 41 is disposed at the left rear side corner portion of the lowersurface 9 b of the sealing resin 9 in an orientation where four sides ofthe lower surface 43 of the terminal main body portion 41 aresubstantially parallel to four sides of the lower surface 9 b of thesealing resin 9.

Among the four side surfaces 45 of the terminal main body portion 41,each of the left side surface and the rear side surface has a first sidesurface portion 46, a second side surface portion 48, and a joiningportion 47. The first side surface portion 46 is continuous to the lowersurface 43 and extends substantially perpendicularly toward the uppersurface 44. The second side surface portion 48 is continuous to theupper surface 44 and extends substantially perpendicularly toward thelower surface 43. At each of the left side surface and the rear sidesurface of the terminal main body portion 41, the first side surfaceportion 46 protrudes further outward in a side direction (directionorthogonal to the vertical direction) than the second side surfaceportion 48. At each of the left side surface and the rear side surfaceof the terminal main body portion 41, the joining portion 47 extendsfrom the second side surface portion 48 toward the first side surfaceportion 46 while expanding outward gradually in the side direction andconnects the second side surface portion 48 and the first side surfaceportion 46.

The first side surface portion 46 of the left side surface and the firstside surface portion 46 of the rear side surface of the terminal mainbody portion 41 are respectively substantially flush with the left sidesurface 9 d and the rear side surface 9 e of the sealing resin 9 and areexposed from the left side surface 9 d and the rear side surface 9 e.That is, the first side surface portion 46 of the left side surface andthe first side surface portion 46 of the rear side surface of theterminal main body portion 41 constitute second exposed surfaces of thefirst drain terminal 4 that are continuous to the first exposed surface.An angle portion formed by intersection of the two first side surfaceportions 46 of the terminal main body portion 41 and angle portionsformed by intersections of the respective first side surface portions 46and the lower surface 43 are also exposed from the sealing resin 9.

The terminal detachment restraining portion 42 is formed such as toprotrude outward in side directions from the right side surface and thefront side surface of the terminal main body portion 41. The terminaldetachment restraining portion 42 is formed to be thinner than theterminal main body portion 41. An upper surface of the terminaldetachment restraining portion 42 is flush with the upper surface 44 ofthe terminal main body portion 41. The first semiconductor chip 2 isdie-bonded to the upper surface of the first drain terminal 4 (includingthe upper surface 44 of the terminal main body portion 41 and the uppersurface of the terminal detachment restraining portion 42).

A solder plating layer (not shown), arranged to increase solderwettability, is formed on the lower surface 43 of the terminal main bodyportion 41 exposed from the lower surface 9 b of the sealing resin 9 andthe first side surface portions 46 exposed from the left side surface 9d and the rear side surface 9 e of the sealing resin 9.

The second drain terminal 6 has, integrally, a terminal main bodyportion 61 of rectangular parallelepiped shape having a rectangularbottom surface shape, and a terminal detachment restraining portion 62.The terminal main body portion 61 has a lower surface 63, an uppersurface 64, positioned at an opposite side to the lower surface 63, andfour side surfaces 65, connecting the lower surface 63 and the uppersurface 64. The lower surface 63 of the terminal main body portion 61 issubstantially flush with the lower surface 9 b of the sealing resin 9and is exposed from the lower surface 9 b. That is, the lower surface 63of the terminal main body portion 61 constitutes a first exposed surfaceof the second drain terminal 6. In bottom view (plan view), the terminalmain body portion 61 is disposed at the right rear side corner portionof the lower surface 9 b of the sealing resin 9 in an orientation wherefour sides of the lower surface 63 of the terminal main body portion 61are substantially parallel to the four sides of the lower surface 9 b ofthe sealing resin 9.

Among the four side surfaces 65 of the terminal main body portion 61,each of the right side surface and the rear side surface has a firstside surface portion 66, a second side surface portion 68, and a joiningportion 67. The first side surface portion 66 is continuous to the lowersurface 63 and extends substantially perpendicularly toward the uppersurface 64. The second side surface portion 68 is continuous to theupper surface 64 and extends substantially perpendicularly toward thelower surface 63. At each of the right side surface and the rear sidesurface of the terminal main body portion 61, the first side surfaceportion 66 protrudes further outward in a side direction (directionorthogonal to the vertical direction) than the second side surfaceportion 68. At each of the right side surface and the rear side surfaceof the terminal main body portion 61, the joining portion 67 extendsfrom the second side surface portion 68 toward the first side surfaceportion 66 while expanding outward gradually in the side direction andconnects the second side surface portion 68 and the first side surfaceportion 66.

The first side surface portion 66 of the right side surface and thefirst side surface portion 66 of the rear side surface of the terminalmain body portion 61 are respectively substantially flush with the rightside surface 9 f and the rear side surface 9 e of the sealing resin 9and are exposed from the right side surface 9 f and the rear sidesurface 9 e. That is, the first side surface portion 66 of the rightside surface and the first side surface portion 66 of the rear sidesurface of the terminal main body portion 61 constitute second exposedsurfaces of the second drain terminal 6 that are continuous to the firstexposed surface. An angle portion formed by intersection of the twofirst side surface portions 66 of the terminal main body portion 61 andangle portions formed by intersections of the respective first sidesurface portions 66 and the lower surface 63 are also exposed from thesealing resin 9.

The terminal detachment restraining portion 62 is formed such as toprotrude outward in side directions from the left side surface and thefront side surface of the terminal main body portion 61. The terminaldetachment restraining portion 62 is formed to be thinner than theterminal main body portion 61. An upper surface of the terminaldetachment restraining portion 62 is flush with the upper surface 66 ofthe terminal main body portion 61. The second semiconductor chip 3 isdie-bonded to the upper surface of the second drain terminal 6(including the upper surface 64 of the terminal main body portion 61 andthe upper surface of the terminal detachment restraining portion 62).

A solder plating layer (not shown), arranged to increase solderwettability, is formed on the lower surface 63 of the terminal main bodyportion 61 exposed from the lower surface 9 b of the sealing resin 9 andthe first side surface portions 66 exposed from the right side surface 9f and the rear side surface 9 e of the sealing resin 9.

Referring to FIG. 1, FIG. 8, and FIG. 10, the first gate terminal 5 has,integrally, a terminal main body portion 51 of rectangularparallelepiped shape having a rectangular bottom surface shape, and aterminal detachment restraining portion 52. The terminal main bodyportion 51 has a lower surface 53, an upper surface 54, positioned at anopposite side to the lower surface 53, and four side surfaces 55,connecting the lower surface 53 and the upper surface 54. The terminalmain body portion 51 has its lower surface 53 exposed from the lowersurface 9 b of the sealing resin 9. The lower surface 53 of the terminalmain body portion 51 is substantially flush with the lower surface 9 bof the sealing resin 9 and is exposed from the lower surface 9 b. Thatis, the lower surface 53 of the terminal main body portion 51constitutes a first exposed surface of the first gate terminal 5. Inbottom view (plan view), the terminal main body portion 51 is disposedat the left front side corner portion of the lower surface 9 b of thesealing resin 9 in an orientation where four sides of the lower surface53 of the terminal main body portion 51 are substantially parallel tothe four sides of the lower surface 9 b of the sealing resin 9.

Among the four side surfaces 55 of the terminal main body portion 51,each of the left side surface and the front side surface has a firstside surface portion 56, a second side surface portion 58, and a joiningportion 57. The first side surface portion 56 is continuous to the lowersurface 53 and extends substantially perpendicularly toward the uppersurface 54. The second side surface portion 58 is continuous to theupper surface 54 and extends substantially perpendicularly toward thelower surface 53. At each of the left side surface and the front sidesurface of the terminal main body portion 51, the first side surfaceportion 56 protrudes further outward in a side direction (directionorthogonal to the vertical direction) than the second side surfaceportion 58. At each of the left side surface and the front side surfaceof the terminal main body portion 51, the joining portion 57 extendsfrom the second side surface portion 58 toward the first side surfaceportion 56 while expanding outward gradually in the side direction andconnects the second side surface portion 58 and the first side surfaceportion 56.

The first side surface portion 56 of the left side surface and the firstside surface portion 56 of the front side surface of the terminal mainbody portion 51 are respectively substantially flush with the left sidesurface 9 d and the front side surface 9 c of the sealing resin 9 andare exposed from the left side surface 9 d and the front side surface 9c. That is, the first side surface portion 56 of the left side surfaceand the first side surface portion 56 of the front side surface of theterminal main body portion 51 constitute second exposed surfaces of thefirst gate terminal 5 that are continuous to the first exposed surface.An angle portion formed by intersection of the two first side surfaceportions 56 of the terminal main body portion 51 and angle portionsformed by intersections of the respective first side surface portions 56and the lower surface 53 are also exposed from the sealing resin 9.

The terminal detachment restraining portion 52 is formed such as toprotrude outward in side directions from the right side surface and therear side surface of the terminal main body portion 51. The terminaldetachment restraining portion 52 is formed to be thinner than theterminal main body portion 51. An upper surface of the terminaldetachment restraining portion 52 is flush with the upper surface 54 ofthe terminal main body portion 51. One end of the second bonding wire 12is connected to the upper surface of the first gate terminal 5(including the upper surface 54 of the terminal main body portion 51 andthe upper surface of the terminal detachment restraining portion 52).

A solder plating layer (not shown), arranged to increase solderwettability, is formed on the lower surface 53 of the terminal main bodyportion 51 exposed from the lower surface 9 b of the sealing resin 9 andthe first side surface portions 56 exposed from the left side surface 9d and the front side surface 9 c of the sealing resin 9.

The second gate terminal 7 has, integrally, a terminal main body portion71 of rectangular parallelepiped shape having a rectangular bottomsurface shape, and a terminal detachment restraining portion 72. Theterminal main body portion 71 has a lower surface 73, an upper surface74, positioned at an opposite side to the lower surface 73, and fourside surfaces 75, connecting the lower surface 73 and the upper surface74. The lower surface 73 of the terminal main body portion 71 issubstantially flush with the lower surface 9 b of the sealing resin 9and is exposed from the lower surface 9 b. That is, the lower surface 73of the terminal main body portion 71 constitutes a first exposed surfaceof the second gate terminal 7. In bottom view (plan view), the terminalmain body portion 71 is disposed at the right front side corner portionof the lower surface 9 b of the sealing resin 9 in an orientation wherefour sides of the lower surface 73 of the terminal main body portion 71are substantially parallel to the four sides of the lower surface 9 b ofthe sealing resin 9.

Among the four side surfaces 75 of the terminal main body portion 71,each of the right side surface and the front side surface has a firstside surface portion 76, a second side surface portion 78, and a joiningportion 77. The first side surface portion 76 is continuous to the lowersurface 73 and extends substantially perpendicularly toward the uppersurface 74. The second side surface portion 78 is continuous to theupper surface 74 and extends substantially perpendicularly toward thelower surface 73. At each of the right side surface and the front sidesurface of the terminal main body portion 71, the first side surfaceportion 76 protrudes further outward in a side direction (directionorthogonal to the vertical direction) than the second side surfaceportion 78. At each of the right side surface and the front side surfaceof the terminal main body portion 71, the joining portion 77 extendsfrom the second side surface portion 78 toward the first side surfaceportion 76 while expanding outward gradually in the side direction andconnects the second side surface portion 78 and the first side surfaceportion 76.

The first side surface portion 76 of the right side surface and thefirst side surface portion 76 of the front side surface of the terminalmain body portion 71 are respectively substantially flush with the rightside surface 9 f and the front side surface 9 c of the sealing resin 9and are exposed from the right side surface 9 f and the front sidesurface 9 c. That is, the first side surface portion 76 of the rightside surface and the first side surface portion 76 of the front sidesurface of the terminal main body portion 71 constitute second exposedsurfaces of the second drain terminal 7 that are continuous to the firstexposed surface. An angle portion formed by intersection of the twofirst side surface portions 76 of the terminal main body portion 71 andangle portions formed by intersections of the respective first sidesurface portions 76 and the lower surface 73 are also exposed from thesealing resin 9.

The terminal detachment restraining portion 72 is formed such as toprotrude outward in side directions from the left side surface and therear side surface of the terminal main body portion 71. The terminaldetachment restraining portion 72 is formed to be thinner than theterminal main body portion 71. An upper surface of the terminaldetachment restraining portion 72 is flush with the upper surface 74 ofthe terminal main body portion 71. One end of the fourth bonding wire 14is connected to the upper surface of the second gate terminal 7(including the upper surface 74 of the terminal main body portion 71 andthe upper surface of the terminal detachment restraining portion 72).

A solder plating layer (not shown), arranged to increase solderwettability, is formed on the lower surface 73 of the terminal main bodyportion 71 exposed from the lower surface 9 b of the sealing resin 9 andthe first side surface portions 76 exposed from the right side surface 9f and the front side surface 9 c of the sealing resin 9.

Referring to FIG. 1, FIG. 8, FIG. 10, and FIG. 11, the common sourceterminal 8 has, integrally, a terminal main body portion 81 ofrectangular parallelepiped shape having a rectangular bottom surfaceshape, and a terminal detachment restraining portion 82. The terminalmain body portion 81 has a lower surface 83, an upper surface 84,positioned at an opposite side to the lower surface 83, and four sidesurfaces 85, connecting the lower surface 83 and the upper surface 84.The lower surface 83 of the terminal main body portion 81 issubstantially flush with the lower surface 9 b of the sealing resin 9and is exposed from the lower surface 9 b. That is, the lower surface 83of the terminal main body portion 81 constitutes a first exposed surfaceof the common source terminal 8. In bottom view (plan view), theterminal main body portion 81 is disposed at a front side centralportion of the lower surface 9 b of the sealing resin 9 in anorientation where four sides of the lower surface 83 of the terminalmain body portion 81 are substantially parallel to the four sides of thelower surface 9 b of the sealing resin 9.

Among the four side surfaces 85 of the terminal main body portion 81,the front side surface has a first side surface portion 86, a secondside surface portion 88, and a joining portion 87. The first sidesurface portion 86 is continuous to the lower surface 83 and extendssubstantially perpendicularly toward the upper surface 84. The secondside surface portion 88 is continuous to the upper surface 84 andextends substantially perpendicularly toward the lower surface 83. Thefirst side surface portion 86 protrudes further outward in a sidedirection (direction orthogonal to the vertical direction) than thesecond side surface portion 88. The joining portion 87 extends from thesecond side surface portion 88 toward the first side surface portion 86while expanding outward gradually in the side direction and connects thesecond side surface portion 88 and the first side surface portion 86.

The first side surface portion 86 of the terminal main body portion 81is substantially flush with the front side surface 9 c of the sealingresin 9 and is exposed from the front side surface 9 c. That is, thefirst side surface portion 86 of the front side surface of the terminalmain body portion 81 constitutes a second exposed surface of the commonsource terminal 8 that is continuous to the first exposed surface. Anangle portion formed by intersection of the first side surface portion86 of the terminal main body portion 81 and the lower surface 83 is alsoexposed from the sealing resin 9.

The terminal detachment restraining portion 82 is formed such as toprotrude rearward from the rear side surface of the terminal main bodyportion 81. The terminal detachment restraining portion 82 is formed tobe thinner than the terminal main body portion 81. An upper surface ofthe terminal detachment restraining portion 82 is flush with the uppersurface 84 of the terminal main body portion 81. One ends of the firstbonding wire 11 and the third bonding wire 13 are connected to the uppersurface of the common source terminal 8 (including the upper surface 84of the terminal main body portion 81 and the upper surface of theterminal detachment restraining portion 82).

A solder plating layer (not shown), arranged to increase solderwettability, is formed on the lower surface 83 of the terminal main bodyportion 81 exposed from the lower surface 9 b of the sealing resin 9 andthe first side surface portion 86 exposed from the front side surface 9c of the sealing resin 9.

In a state where the respective terminals 4, 5, 6, 7, and 8 areresin-sealed together with the first semiconductor chip 2 and the secondsemiconductor chip 3, the sealing resin 9 extends around to below therespective terminal detachment restraining portions 42, 52, 62, 72, and82, thus preventing detachment of the respective terminals 4, 5, 6, 7,and 8 from the sealing resin 9.

Referring to FIG. 7, the lower surface 9 b of the sealing resin 9 has afront side 10 c, a left side 10 d, a rear side 10 e, and a right side 10f corresponding respectively to the front side surface 9 c, the leftside surface 9 d, the rear side surface 9 e, and the right side surface9 f. In the present preferred embodiment, a shape and size of the lowersurface 43 of the first drain terminal 4 and a shape and size of thelower surface 63 of the second drain terminal 6 are substantially equal.Also, a shape and size of the lower surface 53 of the first gateterminal 5 and a shape and size of the lower surface 73 of the secondgate terminal 7 are substantially equal.

Let a length of the front side 10 c (rear side 10 e) of the lowersurface 9 b of the sealing resin 9 be L and a length of the left side 10d (right side 10 f) be W. With each of the lower surface 43 of the firstdrain terminal 4 and the lower surface 63 of the second drain terminal6, let a length of a side parallel to the front side 10 c of the lowersurface 9 b be LD1 and a length of a side parallel to the left side 10 dof the lower surface 9 b be LD2.

With each of the lower surface 53 of the first gate terminal 5 and thelower surface 73 of the second gate terminal 7, let a length of a sideparallel to the front side 10 c of the lower surface of the sealingresin 9 be LG1 and a length of a side parallel to the left side 10 d ofthe lower surface of the sealing resin 9 be LG2. With the lower surface83 of the common source terminal 8, let a length of a side parallel tothe front side 10 c of the lower surface of the sealing resin 9 be LS1and a length of a side parallel to the left side 10 d of the lowersurface of the sealing resin 9 be LS2.

Let an interval between the lower surface 43 of the first drain terminal4 and the lower surface 63 of the second drain terminal 6 in a directionalong the rear side 10 e of the lower surface of the sealing resin 9 bed1. Let an interval between the lower surface 53 of the first gateterminal 5 and the lower surface 83 of the common source terminal 8 in adirection along the front side 10 c of the lower surface of the sealingresin 9 be d2. Let an interval between the lower surface 73 of thesecond gate terminal 7 and the lower surface 83 of the common sourceterminal 8 in the direction along the front side 10 c of the lowersurface of the sealing resin 9 be d3. Let an interval between the lowersurface 43 of the first drain terminal 4 and the lower surface 53 of thefirst gate terminal 5 in a direction along the left side 10 d of thelower surface of the sealing resin 9 be d4. Let an interval between thelower surface 63 of the second drain terminal 6 and the lower surface 73of the second gate terminal 7 in a direction along the right side 10 fof the lower surface of the sealing resin 9 be d5.

The semiconductor device 1 preferably satisfies the following formulae(1) and (2).d1=d2=d3=d4=d5  (1)LS2=LG2  (2)

The semiconductor device 1 preferably further satisfies the followingformulae (3), (4), (5), and (6).LS1=d1  (3)LD2=LD1  (4)LG2=LG1  (5)LD1>LG1  (6)

In the present preferred embodiment, LD1, LD2, LS1, LS2, LG1, LG2, LS1,LS2, and d1 to d5 are set to satisfy the formulae (1) to (6).

Specifically, in the present preferred embodiment, LD1, LD2, LS1, LS2,LG1, LG2, LS1, LS2, and d1 to d5 are set to the following lengths.LD1=LD2=0.3 mmLG1=LG2=LS2=0.1 mmd1=d2=d3=d4=d5=LS1=0.2 mm

For efficient dissipation of the heat of the semiconductor chips 2 and3, it is better for areas of the lower surfaces 43 and 63 of the drainterminals 4 and 6 to be larger. However if the areas of the lowersurfaces 43 and 63 of the drain terminals 4 and 6 are increased, thesemiconductor device 1 increases in size. In the present preferredembodiment, to miniaturize the semiconductor device 1, sizes of thelower surfaces 43 and 63 of the drain terminals 4 and 6 are set to theminimum necessary sizes for heat dissipation of the semiconductor chips2 and 3. Specifically, the lengths LD1 and LD2 of the sides of the lowersurfaces 43 and 63 of the drain terminals 4 and 6 are set to 0.3 mm.

The one ends of the bonding wires 12 and 14 are connected to the uppersurfaces 54 and 74 of the gate terminals 5 and 7. In the presentpreferred embodiment, in order to miniaturize the semiconductor device1, sizes of the upper surfaces 54 and 74 of the gate terminals 5 and 7are set to the minimum necessary sizes for connecting the one ends ofthe bonding wires 12 and 14. Specifically, the sizes of the uppersurfaces 54 and 74 of the gate terminals 5 and 7 are set to 0.1 mm×0.1mm. Accordingly, the lengths LG1 and LG2 of the sides of the uppersurfaces 54 and 74 of the gate terminals 5 and 7 are set to 0.1 mm.

As shall be described below, in mounting the semiconductor device 1 on amounting substrate 201 (see FIG. 12 and FIG. 13), the lower surfaces 43,53, 63, 73, and 83 of the respective terminals 4, 5, 6, 7, and 8 arecoated with solder 211. In this process, a measure must be taken toprevent mutual contact of the solder coated on the lower surfaces of theterminals 4 to 8 that are adjacent. In the present preferred embodiment,in order to miniaturize the semiconductor device 1, the intervalsbetween the terminals 4 to 8 that are adjacent are set to the minimumnecessary intervals for preventing mutual contact of the solder coatedon the terminals 4 to 8 that are adjacent. Specifically, the intervalsd1 to d5 between the terminals 4 to 8 that are adjacent are set to 0.2mm.

To acquire such intervals d1 to d5, the lengths LS1 and LS2 of the twomutually adjacent sides of the lower surface 83 of the common sourceterminal 8 are set to 0.2 mm and 0.1 mm, respectively.

That is, in the present preferred embodiment, the length L of thesemiconductor device 1 is 0.8 mm (=0.3 mm+0.2 mm+0.3 mm). The width W ofthe semiconductor device 1 is 0.6 mm (=0.1 mm+0.2 mm+0.3 mm). A height H(see FIG. 5 and FIG. 6) of the semiconductor device 1 is 0.36 mm. Also,a height h (see FIG. 5 and FIG. 6) of each of the first side surfaceportions 46, 56, 66, 76, and 86 of the respective terminals 4, 5, 6, 7,and 8 exposed from the side surfaces 9 c to 9 f of the sealing resin 9is 0.06 mm. The abovementioned dimensions of the respective portions arebut an example and are not restricted thereto.

In the present preferred embodiment, a sum of the area of the lowersurface 43 of the first drain terminal 4 and the area of the lowersurface 63 of the second drain terminal 6 is0.3*0.3+0.3*0.3+0.3*0.3=0.18 mm². The total sum of the areas of thelower surfaces of the drain terminals 4 and 6 is ⅜ (=18/48) of an areaof an entirety of a lower surface of the semiconductor device 1. Also, atotal sum of the areas of the lower surfaces of the metal terminals (thedrain terminals 4 and 6, the gate terminals 5 and 7, and the commonsource terminal 8) is 11/24 (=(18+1+1+2)/48) of the area of the entiretyof the lower surface of the semiconductor device 1. A heat dissipationproperty is thus satisfactory with the semiconductor device 1 of thepresent preferred embodiment.

Also, the areas of the bottom surfaces 43 and 63 of the drain terminals4 and 6 may be made even smaller to further prevent the mutual contactof solder. For example, it may be arranged such that LD2=0.2 mm andLD1=0.3 mm or LD2=0.3 mm and LD1=0.2 mm. In such case, the total sum ofthe areas of the lower surfaces 43 and 63 of the drain terminals 4 and 6is ¼ (=12/48) of the area of the entirety of the lower surface of thesemiconductor device 1 and the total sum of the areas of the lowersurfaces of the metal terminals (the drain terminals 4 and 6, the gateterminals 5 and 7, and the common source terminal 8) is ⅓(=(12+1+1+2)/48) of the area of the entirety of the lower surface of thesemiconductor device 1.

That is, from the standpoint of heat dissipation property, it ispreferable for the total sum of the areas of the lower surfaces 43 and63 of the drain terminals 4 and 6 to be ¼ to ⅜ of the area of theentirety of the lower surface of the semiconductor device 1. Alsopreferably, the total sum of the areas of the lower surfaces of themetal terminals (the drain terminals 4 and 6, the gate terminals 5 and7, and the common source terminal 8) is ⅓ to 11/24 of the area of theentirety of the lower surface of the semiconductor device 1.

FIG. 12 and FIG. 13 are illustrative sectional views of a mounted stateof the semiconductor device 1. FIG. 12 is a sectional view correspondingto FIG. 9, and FIG. 13 is a sectional view corresponding to FIG. 10.

The semiconductor device 1 is mounted on a surface of the mountingsubstrate (wiring substrate) 201. A first drain terminal land 204, afirst gate terminal land 205, a second drain terminal land 206, a secondgate terminal land 207, and a common source terminal land 208 are formedon the surface 202 of the mounting substrate 201.

To mount the semiconductor device 1 on the mounting substrate 201,first, the solder 211 that is creamy is coated on surfaces of therespective lands 204 to 208 on the mounting substrate 201. Next, thesemiconductor device 1 is placed on the lands 204 to 208 in anorientation such that the lower surface 43 of the terminal 4, the lowersurface 53 of the terminal 5, the lower surface 63 of the terminal 6,the lower surface 73 of the terminal 7, and the lower surface 83 of theterminal 8 of the semiconductor device 1 face the lands 204, 205, 206,207, and 208, respectively, on the mounting substrate 201.

Next, the semiconductor device 1, in a state of being pressed againstthe lands 204 to 208 of the mounting substrate 201, is heated for afixed time and thereafter cooled. The terminals 4, 5, 6, 7, and 8 of thesemiconductor device 1 are thereby bonded by the solder 211 to the lands204, 205, 206, 207, and 208, respectively, on the mounting substrate201.

The plating layers for increasing solder wettability are formed on thelower surfaces 43, 53, 63, 73, and 83 and the first side surfaceportions 46, 56, 66, 76, and 86 of the respective terminals 4, 5, 6, 7,and 8. Therefore when the lower surfaces 43, 53, 63, 73, and 83 of therespective terminals 4, 5, 6, 7, and 8 become bonded to the cream solder211 on the respective lands 204, 205, 206, 207, and 208, the creamsolder 211 closely adheres, so as to creep up, to the first side surfaceportions 46, 56, 66, 76, and 86 of the respective terminals 4, 5, 6, 7,and 8. Consequently, a mounting strength of the semiconductor device 1and the mounting substrate 201 can be improved and connectionreliability can be improved.

Also, so-called solder fillets are thereby formed on the first sidesurface portions 46, 56, 66, 76, and 86 of the respective terminals 4,5, 6, 7, and 8 and therefore bonding (soldering) states of therespective terminals 4, 5, 6, 7, and 8 and the respective lands 204,205, 206, 207, and 208 can be readily inspected visually.

With the semiconductor device 1 according to the first preferredembodiment described above, the source electrode of the firstsemiconductor chip 2 and the source electrode of the secondsemiconductor chip 3 are electrically connected to the common sourceterminal 8. Therefore there is no need to connect a source terminal ofthe first semiconductor chip 2 and a source terminal of the secondsemiconductor chip 3 at an exterior of the semiconductor device 1 inusing the semiconductor device 1 as a bidirectional switch.

Also with the semiconductor device according to the first preferredembodiment described above, the respective terminals 4, 5, 6, 7, and 8have the lower surfaces (first exposed surfaces) 43, 53, 63, 73, and 83that are substantially flush with the lower surface 9 b of the sealingresin 9 and are exposed from the lower surface 9 b of the sealing resin9, and therefore miniaturization can be achieved in comparison to asemiconductor device having lead terminals projecting from an outersurface of the sealing resin 9.

Also with the semiconductor device 1 according to the first preferredembodiment described above, the respective terminals 4, 5, 6, 7, and 8have the first side surface portions (second exposed surfaces) 46, 56,66, 76, and 86 that are exposed from the side surfaces 9 c to 9 f of thesealing resin 9 and therefore confirmation of the bonding states(mounting properties) of the respective terminals 4, 5, 6, 7, and 8 andthe respective lands 204, 205, 206, 207, and 208 is made easy.

Although with the first preferred embodiment described above, therespective terminals 4, 5, 6, 7, and 8 have the first side surfaceportions (second exposed surfaces) 46, 56, 66, 76, and 86 that areexposed from the side surfaces 9 c to 9 f of the sealing resin 9, suchexposed surfaces 46, 56, 66, 76, and 86 do not have to be provided.

Also although with the first preferred embodiment described above, therespective terminals 4, 5, 6, 7, and 8 have the lower surfaces (firstexposed surfaces) 43, 53, 63, 73, and 83 that are exposed from the lowersurface 9 b of the sealing resin 9, the respective terminals 4 to 8 mayhave, in place of such exposed surfaces, upper surfaces that aresubstantially flush with the upper surface 9 a of the sealing resin 9and are exposed from the upper surface 9 a of the sealing resin 9.

Also, the first and second drain terminals 4 and 6 may have exposedsurfaces exposed from one surface among the upper surface 9 a and thelower surface 9 b of the sealing resin 9, and the first gate terminal 5,the second gate terminal 7, and the common source terminal 8 may haveexposed surfaces exposed from the other surface among the upper surface9 a and the lower surface 9 b of the sealing resin 9.

FIG. 16 is an illustrative perspective view of a semiconductor deviceaccording to a second preferred embodiment of the present invention.FIG. 17 is an illustrative plan view of FIG. 16. FIG. 18 is anillustrative front view of FIG. 16. FIG. 19 is an illustrative rear viewof FIG. 16. FIG. 20 is an illustrative left side view of FIG. 16. FIG.21 is an illustrative right side view of FIG. 16. FIG. 22 is anillustrative bottom view of FIG. 16. FIG. 23 is a plan view of aninternal structure. FIG. 24 is a sectional view taken along lineXXIV-XXIV of FIG. 23. FIG. 25 is a sectional view taken along lineXXV-XXV of FIG. 23. FIG. 26 is a sectional view taken along lineXXVI-XXVI of FIG. 23.

As with the semiconductor device 1 according to the first preferredembodiment, the semiconductor device 1A shown in FIG. 16 to FIG. 26 is adevice arranged to realize the bidirectional switch 100 represented bythe electric circuit such as shown in FIG. 14.

The semiconductor device 1A shall now be described in detail withreference to FIG. 16 to FIG. 26. The semiconductor device 1A has asubstantially oblong shape in plan view. For convenience of description,a +X direction, a −X direction, a +Y direction, a −Y direction, a +Zdirection, and a −Z direction, shown in FIG. 16, may be used below. The+X direction and the −X direction are two directions along a long sideof the semiconductor device 1A in plan view and these shall be referredto simply as the “X direction” when referred to collectively. The +Ydirection and the −Y direction are two directions along a short side ofthe semiconductor device 1A in plan view and these shall be referred tosimply as the “Y direction” when referred to collectively.

The +Z direction and the −Z direction are two directions perpendicularto a surface of the semiconductor device 1A in plan view and these shallbe referred to simply as the “Z direction” when referred tocollectively. A +Z direction side surface of the semiconductor device 1Amay be referred to as an upper surface, and a −Z direction side surfaceof the semiconductor device 1A may be referred to as a lower surface ora bottom surface. FIG. 16 shows an appearance of the semiconductordevice 1A in a state where the lower surface (−Z direction side surface)is disposed to face upward.

Mainly referring to FIG. 16 and FIG. 23 to FIG. 26, the semiconductordevice 1A includes a first semiconductor chip 2, functioning as thefirst MOSFET 101 of FIG. 14, and a second semiconductor chip 3,functioning as the second MOSFET 102 of FIG. 14. The semiconductordevice 1A also includes the first drain terminal 4, the first gateterminal 5, the second drain terminal 6, the second gate terminal 7, thecommon source terminal 8, first to fourth bonding wires (metalconnecting members) 11 to 14, and a sealing resin 9.

A large difference between the semiconductor device 1A according to thesecond preferred embodiment and the semiconductor device 1 according tothe first preferred embodiment is that the shapes of the first drainterminal 4, the first gate terminal 5, the second drain terminal 6, thesecond gate terminal 7, and the common source terminal 8 are different.

The first semiconductor chip 2 is die-bonded on the first drain terminal4 in a state where a surface (device forming surface), at a side atwhich a functional element is formed, is faced in the +Z direction. Adrain electrode is formed at a bottom surface (lower surface) of thefirst semiconductor chip 2. The drain electrode of the firstsemiconductor chip 2 is mechanically and electrically connected to anupper surface (+Z direction side surface) of the first drain terminal 4.

A source electrode (source pad) 2S and a gate electrode (gate pad) 2G(see FIG. 23) are formed on an upper surface of the first semiconductorchip 2. The source electrode 2S is connected to the common sourceterminal 8 by the bonding wire 11. The gate electrode 2G is connected tothe first gate terminal 5 by the bonding wire 12.

The second semiconductor chip 3 is die-bonded on the second drainterminal 6 in a state where a surface (device forming surface), at aside at which a functional element is formed, is faced upward. A drainelectrode is formed at a bottom surface (lower surface) of the secondsemiconductor chip 3. The drain electrode of the second semiconductorchip 3 is mechanically and electrically connected to an upper surface(+Z direction side surface) of the second drain terminal 6.

A source electrode (source pad) 3S and a gate electrode (gate pad) 3G(see FIG. 23) are formed on an upper surface of the second semiconductorchip 3. The source electrode 3S is connected to the common sourceterminal 8 by the bonding wire 13. The gate electrode 3G is connected tothe second gate terminal 7 by the bonding wire 14. The respectiveterminals 4 to 8 are formed from metal thin plates constituted of copperor an alloy that contains copper.

The sealing resin 9 is constituted, for example, of an epoxy resin. Asshown in FIG. 16, the sealing resin 9 is formed, for example, to arectangular parallelepiped shape that is flat in the Z direction. The Zdirection is synonymous to a thickness direction of the semiconductordevice 1A. The sealing resin 9 of rectangular parallelepiped shape hasan upper surface 9 a, constituting a +Z direction side surface, a lowersurface 9 b, constituting a −Z direction side surface, and side surfaces9 c to 9 f extending in substantially perpendicular directions withrespect to the upper surface 9 a and the lower surface 9 b. The uppersurface 9 a and the lower surface 9 b are both flat surfaces.

The upper surface 9 a and the lower surface 9 b are formed torectangular shapes that are long in the X direction in plan view. Theside surfaces 9 c to 9 f are continuous to the upper surface 9 a and thelower surface 9 b. In detail, the side surfaces 9 c to 9 f are formedover an entire periphery, excluding the upper surface 9 a and the lowersurface 9 b, of the semiconductor device 1A. In other words, thesemiconductor device 1A has the four side surfaces 9 c to 9 f that arecontinuous to respective four sides of the upper surface 9 a and thelower surface 9 b. The four side surfaces 9 c to 9 f are constituted ofthe +Y direction side surface 9 c, the −X direction side surface 9 d,the −Y direction side surface 9 e, and the +X direction side surface 9f.

As shown in FIG. 23, when an interior of the sealing resin 9 is viewedfrom a plane, the first drain terminal 4 is disposed at a corner portionat a −Y direction side and −X direction side and the second drainterminal 6 is disposed at a corner portion at a −Y direction side and +Xdirection side. Also, the first gate terminal 5 is disposed at a cornerportion at a +Y direction side and −X direction side, the second gateterminal 7 is disposed at a corner portion at a +Y direction side and +Xdirection side, and the common source terminal 8 is disposed at aposition between the first gate terminal 5 and the second gate terminal7.

Referring to FIG. 16, FIG. 17, FIG. 22, FIG. 23, and FIG. 24, the firstdrain terminal 4 has, integrally, a terminal main body portion 41 ofquadratic prism shape having a quadrilateral bottom surface shape, and aterminal detachment restraining portion 42. The terminal main bodyportion 41 has a lower surface 43, an upper surface 44, positioned at anopposite side to the lower surface 43, and four side surfaces,connecting the lower surface 43 and the upper surface 44. The four sidesurfaces are constituted of a +Y direction side surface 45 c, a −Xdirection side surface 45 d, a −Y direction side surface 45 e, and a +Xdirection side surface 45 f.

The −X direction side surface 45 d is parallel to the Y direction inplan view. The −Y direction side surface 45 e extends in the +Xdirection from a −Y direction side edge portion of the −X direction sidesurface 45 d in plan view. The +X direction side surface 45 f extends inthe +Y direction and obliquely toward the −X direction from a +Xdirection side edge portion of the −Y direction side surface 45 e inplan view. The +Y direction side surface 45 c extends in the +Xdirection and obliquely toward the −Y direction from a +Y direction sideedge portion of the −X direction side surface 45 d and is connected to a+Y direction side edge portion of the +X direction side surface 45 f inplan view. A connection portion of the +X direction side surface 45 fand the +Y direction side surface 45 c is formed to a curved surface 45g projecting outward of the terminal main body portion 41 in plan view.

The lower surface 43 of the terminal main body portion 41 issubstantially flush with the lower surface 9 b of the sealing resin 9and is exposed from the lower surface 9 b. That is, the lower surface 43of the terminal main body portion 41 constitutes a first exposed surfaceof the first drain terminal 4. In bottom view (plan view), the terminalmain body portion 41 is disposed at the corner portion at the −Ydirection side and −X direction side of the lower surface 9 b of thesealing resin 9. More specifically, in bottom view, the terminal mainbody portion 41 is disposed in an orientation where, two sides, amongfour sides of the lower surface 43 of the terminal main body portion 41,that correspond to a lower edge of the −X direction side surface 45 dand a lower edge of the −Y direction side surface 45 e are respectivelysubstantially parallel to two sides, among four sides of the lowersurface 9 b of the sealing resin 9, that correspond to a lower edge ofthe −X direction side surface 9 d and a lower edge of the −Y directionside surface 9 e.

That is, the lower surface (first exposed surface) 43 of the terminalmain body portion 41 is, in plan view, of a quadrilateral shape having afirst side and a second side matching two sides of the corner portion ofthe sealing resin 9 at which the lower surface 43 is disposed and havinga third side (lower edge of the +X direction side surface 45 f) and afourth side (lower edge of the +Y direction side surface 45 c) with oneends connected respectively to the first side and the second side andother ends connected mutually. A connection portion of the third sideand the fourth side is formed to a curved shape projecting outward ofthe lower surface (first exposed surface) 43.

Each of the −X direction side surface 45 d and the −Y direction sidesurface 45 e of the terminal main body portion 41 has a first sidesurface portion 46, a second side surface portion 48, and a joiningportion 47. The first side surface portion 46 is continuous to the lowersurface 43 and extends substantially perpendicularly toward the uppersurface 44. The second side surface portion 48 is continuous to theupper surface 44 and extends substantially perpendicularly toward thelower surface 43. At each of −X direction side surface 45 d and the −Ydirection side surface 45 e of the terminal main body portion 41, thefirst side surface portion 46 protrudes further outward in a sidedirection (direction orthogonal to the Z direction) than the second sidesurface portion 48. At each of the −X direction side surface 45 d andthe −Y direction side surface 45 e of the terminal main body portion 41,the joining portion 47 extends from the second side surface portion 48toward the first side surface portion 46 while expanding outwardgradually in the side direction and connects the second side surfaceportion 48 and the first side surface portion 46.

The first side surface portion 46 of the −X direction side surface 45 dand the first side surface portion 46 of the −Y direction side surface45 e of the terminal main body portion 41 are respectively substantiallyflush with the −X direction surface 9 d and the −Y direction sidesurface 9 e of the sealing resin 9 and are exposed from the −X directionside surface 9 d and the −Y direction side surface 9 e. That is, thefirst side surface portion 46 of the −X direction side surface 45 d andthe first side surface portion 46 of the −Y direction side surface 45 eof the terminal main body portion 41 constitute second exposed surfacesof the first drain terminal 4 that are continuous to the first exposedsurface. An angle portion formed by intersection of the two first sidesurface portions 46 of the terminal main body portion 41 and angleportions formed by intersections of the respective first side surfaceportions 46 and the lower surface 43 are also exposed from the sealingresin 9.

The terminal detachment restraining portion 42 is formed such as toprotrude outward in side directions from upper portions of the +Xdirection side surface 45 f and the +Y direction side surface 45 c ofthe terminal main body portion 41. An upper surface of the terminaldetachment restraining portion 42 is flush with the upper surface 44 ofthe terminal main body portion 41.

At the +X direction side surface 45 f and the +Y direction side surface45 c of the terminal main body portion 41, a side surface portion 49,between a lower edge of the terminal detachment restraining portion 42and a lower edge of the terminal main body portion 41, extends whilenarrowing gradually inward in side directions from the lower edge of theterminal detachment restraining portion 42 to the lower edge of theterminal main body portion 41 and connects the lower edge of theterminal detachment restraining portion 42 and the lower edge of theterminal main body portion 41. A height position of the lower edge ofthe terminal detachment restraining portion 42 is further to the upperside (+Z direction side) by just h1 than height positions of upper endsof the first side surface portions 46 of the −X direction side surface45 d and the −Y direction side surface 45 e of the terminal main bodyportion 41.

The first semiconductor chip 2 is die-bonded to the upper surface of thefirst drain terminal 4 (including the upper surface 44 of the terminalmain body portion 41 and the upper surface of the terminal detachmentrestraining portion 42).

A solder plating layer 94, arranged to increase solder wettability, isformed on the lower surface 43 of the terminal main body portion 41exposed from the lower surface 9 b of the sealing resin 9 and the firstside surface portions 46 exposed from the −X direction side surface 9 dand the −Y direction side surface 9 e of the sealing resin 9. In FIG. 16to FIG. 23, the lead plating layer 94 is omitted for convenience ofdescription.

The second drain terminal 6 has, integrally, a terminal main bodyportion 61 of quadratic prism shape having a quadrilateral bottomsurface shape, and a terminal detachment restraining portion 62. Theterminal main body portion 61 has a lower surface 63, an upper surface64, positioned at an opposite side to the lower surface 63, and fourside surfaces, connecting the lower surface 63 and the upper surface 64.The four side surfaces are constituted of a +Y direction side surface 65c, a −X direction side surface 65 d, a −Y direction side surface 65 e,and a +X direction side surface 65 f.

The +X direction side surface 65 f is parallel to the Y direction inplan view. The −Y direction side surface 65 e extends in the −Xdirection from a −Y direction side edge portion of the +X direction sidesurface 65 f in plan view. The −X direction side surface 65 d extends inthe +Y direction and obliquely toward the +X direction from a −Xdirection side edge portion of the −Y direction side surface 65 e inplan view. The +Y direction side surface 65 c extends in the −Xdirection and obliquely toward the −Y direction from a +Y direction sideedge portion of the +X direction side surface 65 f and is connected to a+Y direction side edge portion of the −X direction side surface 65 d inplan view. A connection portion of the −X direction side surface 65 dand the +Y direction side surface 65 c is formed to a curved surface 65g projecting outward of the terminal main body portion 61 in plan view.

The lower surface 63 of the terminal main body portion 61 issubstantially flush with the lower surface 9 b of the sealing resin 9and is exposed from the lower surface 9 b. That is, the lower surface 63of the terminal main body portion 61 constitutes a first exposed surfaceof the second drain terminal 6. In bottom view (plan view), the terminalmain body portion 61 is disposed at the corner portion at the −Ydirection side and +X direction side of the lower surface 9 b of thesealing resin 9. More specifically, in bottom view, the terminal mainbody portion 61 is disposed in an orientation where, two sides, amongfour sides of the lower surface 63 of the terminal main body portion 61,that correspond to a lower edge of the +X direction side surface 65 fand a lower edge of the −Y direction side surface 65 e are respectivelysubstantially parallel to two sides, among the four sides of the lowersurface 9 b of the sealing resin 9, that correspond to a lower edge ofthe +X direction side surface 9 f and the lower edge of the −Y directionside surface 9 e.

That is, the lower surface (first exposed surface) 63 of the terminalmain body portion 61 is, in plan view, of a quadrilateral shape having afirst side and a second side matching two sides of the corner portion ofthe sealing resin 9 at which the lower surface 63 is disposed and havinga third side (lower edge of the +Y direction side surface 65 c) and afourth side (lower edge of the −X direction side surface 65 d) with oneends connected respectively to the first side and the second side andother ends connected mutually. A connection portion of the third sideand the fourth side is formed to a curved shape projecting outward ofthe lower surface (first exposed surface) 63.

Each of the +X direction side surface 65 f and the −Y direction sidesurface 65 e of the terminal main body portion 61 has a first sidesurface portion 66, a second side surface portion 68, and a joiningportion 67. The first side surface portion 66 is continuous to the lowersurface 63 and extends substantially perpendicularly toward the uppersurface 64. The second side surface portion 68 is continuous to theupper surface 64 and extends substantially perpendicularly toward thelower surface 63. At each of the +X direction side surface 65 f and the−Y direction side surface 65 e of the terminal main body portion 61, thefirst side surface portion 66 protrudes further outward in a sidedirection (direction orthogonal to the Z direction) than the second sidesurface portion 68. At each of the +X direction side surface 65 f andthe −Y direction side surface 65 e of the terminal main body portion 61,the joining portion 67 extends from the second side surface portion 68toward the first side surface portion 66 while expanding outwardgradually in the side direction and connects the second side surfaceportion 68 and the first side surface portion 66.

The first side surface portion 66 of the +X direction side surface 65 fand the first side surface portion 66 of the −Y direction side surface65 e of the terminal main body portion 61 are respectively substantiallyflush with the +X direction side surface 9 f and the −Y direction sidesurface 9 e of the sealing resin 9 and are exposed from the +X directionside surface 9 f and the −Y direction side surface 9 e. That is, thefirst side surface portion 66 of the +X direction side surface 65 f andthe first side surface portion 66 of the −Y direction side surface 65 eof the terminal main body portion 61 constitute second exposed surfacesof the second drain terminal 6 that are continuous to the first exposedsurface. An angle portion formed by intersection of the two first sidesurface portions 66 of the terminal main body portion 61 and angleportions formed by intersections of the respective first side surfaceportions 66 and the lower surface 63 are also exposed from the sealingresin 9.

The terminal detachment restraining portion 62 is formed such as toprotrude outward in side directions from upper portions of the −Xdirection side surface 65 d and the +Y direction side surface 65 c ofthe terminal main body portion 61. An upper surface of the terminaldetachment restraining portion 62 is flush with the upper surface 64 ofthe terminal main body portion 61.

At the −X direction side surface 65 d and the +Y direction side surface65 c of the terminal main body portion 61, a side surface portion 69,between a lower edge of the terminal detachment restraining portion 62and a lower edge of the terminal main body portion 61, extends whilenarrowing gradually inward in side directions from the lower edge of theterminal detachment restraining portion 62 to the lower edge of theterminal main body portion 61 and connects the lower edge of theterminal detachment restraining portion 62 and the lower edge of theterminal main body portion 61. A height position of the lower edge ofthe terminal detachment restraining portion 62 is further to the upperside (+Z direction side) by just h1 than height positions of upper endsof the first side surface portions 66 of the +X direction side surface65 f and the −Y direction side surface 65 e of the terminal main bodyportion 61.

The second semiconductor chip 3 is die-bonded to the upper surface ofthe second drain terminal 6 (including the upper surface 64 of theterminal main body portion 61 and the upper surface of the terminaldetachment restraining portion 62).

A solder plating layer 96, arranged to increase solder wettability, isformed on the lower surface 63 of the terminal main body portion 61exposed from the lower surface 9 b of the sealing resin 9 and the firstside surface portions 66 exposed from the +X direction side surface 9 fand the −Y direction side surface 9 e of the sealing resin 9. In FIG. 16to FIG. 23, the lead plating layer 96 is omitted for convenience ofdescription.

Referring to FIG. 16, FIG. 17, FIG. 22, FIG. 23, and FIG. 25, the firstgate terminal 5 has, integrally, a terminal main body portion 51 ofquadratic prism shape having a quadrilateral bottom surface shape, and aterminal detachment restraining portion 52. The terminal main bodyportion 51 has a lower surface 53, an upper surface 54, positioned at anopposite side to the lower surface 53, and four side surfaces,connecting the lower surface 53 and the upper surface 54. The four sidesurfaces are constituted of a +Y direction side surface 55 c, a −Xdirection side surface 55 d, a −Y direction side surface 55 e, and a +Xdirection side surface 55 f.

The +Y direction side surface 55 c is parallel to the X direction inplan view. The −X direction side surface 55 d extends in the −Ydirection from a +X direction side edge portion of the +Y direction sidesurface 55 c in plan view. The −Y direction side surface 55 e extends inthe +X direction and obliquely toward the +Y direction from a −Ydirection side edge portion of the −X direction side surface 55 d inplan view. The +X direction side surface 55 f extends in the −Ydirection and obliquely toward the −X direction from a +X direction sideedge portion of the +Y direction side surface 55 c and is connected to a+X direction side edge portion of the −Y direction side surface 55 e inplan view. A connection portion of the +X direction side surface 55 fand the −Y direction side surface 55 e is formed to a curved surface 55g projecting outward of the terminal main body portion 51 in plan view.

The terminal main body portion 51 has its lower surface 53 exposed fromthe lower surface 9 b of the sealing resin 9. The lower surface 53 ofthe terminal main body portion 51 is substantially flush with the lowersurface 9 b of the sealing resin 9 and is exposed from the lower surface9 b. That is, the lower surface 53 of the terminal main body portion 51constitutes a first exposed surface of the first gate terminal 5. Inbottom view (plan view), the terminal main body portion 51 is disposedat the corner portion at the +Y direction side and −X direction side ofthe lower surface 9 b of the sealing resin 9. More specifically, inbottom view, the terminal main body portion 51 is disposed in anorientation where, two sides, among four sides of the lower surface 53of the terminal main body portion 51, that correspond to a lower edge ofthe −X direction side surface 55 d and a lower edge of the +Y directionside surface 55 c are respectively substantially parallel to two sides,among the four sides of the lower surface 9 b of the sealing resin 9,that correspond to the lower edge of the −X direction side surface 9 dand a lower edge of the +Y direction side surface 9 c.

That is, the lower surface (first exposed surface) 53 of the terminalmain body portion 51 is, in plan view, of a quadrilateral shape having afirst side and a second side matching two sides of the corner portion ofthe sealing resin 9 at which the lower surface 53 is disposed and havinga third side (lower edge of the +X direction side surface 55 f) and afourth side (lower edge of the −Y direction side surface 55 e) with oneends connected respectively to the first side and the second side andother ends connected mutually. A connection portion of the third sideand the fourth side is formed to a curved shape projecting outward ofthe lower surface (first exposed surface) 53.

Each of the −X direction side surface 55 d and the +Y direction sidesurface 55 c of the terminal main body portion 51 has a first sidesurface portion 56, a second side surface portion 58, and a joiningportion 57. The first side surface portion 56 is continuous to the lowersurface 53 and extends substantially perpendicularly toward the uppersurface 54. The second side surface portion 58 is continuous to theupper surface 54 and extends substantially perpendicularly toward thelower surface 53. At each of the −X direction side surface 55 d and the+Y direction side surface 55 c of the terminal main body portion 51, thefirst side surface portion 56 protrudes further outward in a sidedirection (direction orthogonal to the Z direction) than the second sidesurface portion 58. At each of the −X direction side surface 55 d andthe +Y direction side surface 55 c of the terminal main body portion 51,the joining portion 57 extends from the second side surface portion 58toward the first side surface portion 56 while expanding outwardgradually in the side direction and connects the second side surfaceportion 58 and the first side surface portion 56.

The first side surface portion 56 of the −X direction side surface 55 dand the first side surface portion 56 of the +Y direction side surface55 c of the terminal main body portion 51 are respectively substantiallyflush with the left side surface 9 d and the front side surface 9 c ofthe sealing resin 9 and are exposed from the left side surface 9 d andthe front side surface 9 c. That is, the first side surface portion 56of the −X direction side surface 55 d and the first side surface portion56 of the +Y direction side surface 55 c of the terminal main bodyportion 51 constitute second exposed surfaces of the first gate terminal5 that are continuous to the first exposed surface. An angle portionformed by intersection of the two first side surface portions 56 of theterminal main body portion 51 and angle portions formed by intersectionsof the respective first side surface portions 56 and the lower surface53 are also exposed from the sealing resin 9.

The terminal detachment restraining portion 52 is formed such as toprotrude outward in side directions from upper portions of the +Xdirection side surface 55 f and the −Y direction side surface 55 e ofthe terminal main body portion 51. An upper surface of the terminaldetachment restraining portion 52 is flush with the upper surface 54 ofthe terminal main body portion 51.

At the +X direction side surface 55 f and the −Y direction side surface55 e of the terminal main body portion 51, a side surface portion 59,between a lower edge of the terminal detachment restraining portion 52and a lower edge of the terminal main body portion 51, extends whilenarrowing gradually inward in side directions from the lower edge of theterminal detachment restraining portion 52 to the lower edge of theterminal main body portion 51 and connects the lower edge of theterminal detachment restraining portion 52 and the lower edge of theterminal main body portion 51. A height position of the lower edge ofthe terminal detachment restraining portion 52 is further to the upperside (+Z direction side) by just h1 than height positions of upper endsof the first side surface portions 56 of the −X direction side surface55 d and the +Y direction side surface 55 c of the terminal main bodyportion 51.

One end of the second bonding wire 12 is connected to the upper surface54 of the terminal main body portion 51 within the upper surface of thefirst gate terminal 5 (including the upper surface 54 of the terminalmain body portion 51 and the upper surface of the terminal detachmentrestraining portion 52).

A solder plating layer 95, arranged to increase solder wettability, isformed on the lower surface 53 of the terminal main body portion 51exposed from the lower surface 9 b of the sealing resin 9 and the firstside surface portions 56 exposed from the −X direction side surface 9 dand the +Y direction side surface 9 c of the sealing resin 9. In FIG. 16to FIG. 23, the lead plating layer 95 is omitted for convenience ofdescription.

The second gate terminal 7 has, integrally, a terminal main body portion71 of quadratic prism shape having a quadrilateral bottom surface shape,and a terminal detachment restraining portion 72. The terminal main bodyportion 71 has a lower surface 73, an upper surface 74, positioned at anopposite side to the lower surface 73, and four side surfaces,connecting the lower surface 73 and the upper surface 74. The four sidesurfaces are constituted of a +Y direction side surface 75 c, a −Xdirection side surface 75 d, a −Y direction side surface 75 e, and a +Xdirection side surface 75 f.

The +X direction side surface 75 f is parallel to the Y direction inplan view. The +Y direction side surface 75 c extends in the −Xdirection from a +Y direction side edge portion of the +X direction sidesurface 75 f in plan view. The −X direction side surface 75 d extends inthe −Y direction and obliquely toward the +X direction from a −Xdirection side edge portion of the +Y direction side surface 75 c inplan view. The −Y direction side surface 75 e extends in the −Xdirection and obliquely toward the +Y direction from a −Y direction sideedge portion of the +X direction side surface 75 f and is connected to a−Y direction side edge portion of the −X direction side surface 75 d inplan view. A connection portion of the −X direction side surface 75 dand the −Y direction side surface 75 e is formed to a curved surface 75g projecting outward of the terminal main body portion 71 in plan view.

The lower surface 73 of the terminal main body portion 71 issubstantially flush with the lower surface 9 b of the sealing resin 9and is exposed from the lower surface 9 b. That is, the lower surface 73of the terminal main body portion 71 constitutes a first exposed surfaceof the second gate terminal 7. In bottom view (plan view), the terminalmain body portion 71 is disposed at the corner portion at the +Ydirection side and +X direction side of the lower surface 9 b of thesealing resin 9. More specifically, in bottom view, the terminal mainbody portion 71 is disposed in an orientation where, two sides, amongfour sides of the lower surface 73 of the terminal main body portion 71,that correspond to lower ends of the +X direction side surface 75 f andthe +Y direction side surface 75 c are respectively substantiallyparallel to two sides, among the four sides of the lower surface 9 b ofthe sealing resin 9, that correspond to lower ends of the +X directionside surface 9 f and the +Y direction side surface 9 c.

That is, the lower surface (first exposed surface) 73 of the terminalmain body portion 71 is, in plan view, of a quadrilateral shape having afirst side and a second side matching two sides of the corner portion ofthe sealing resin 9 at which the lower surface 73 is disposed and havinga third side (lower edge of the −X direction side surface 75 d) and afourth side (lower edge of the −Y direction side surface 75 e) with oneends connected respectively to the first side and the second side andother ends connected mutually. A connection portion of the third sideand the fourth side is formed to a curved shape projecting outward ofthe lower surface (first exposed surface) 73.

Each of the +X direction side surface 75 f and the +Y direction sidesurface 75 c of the terminal main body portion 75 has a first sidesurface portion 76, a second side surface portion 78, and a joiningportion 77. The first side surface portion 76 is continuous to the lowersurface 73 and extends substantially perpendicularly toward the uppersurface 74. The second side surface portion 78 is continuous to theupper surface 74 and extends substantially perpendicularly toward thelower surface 73. At each of the +X direction side surface 75 f and the+Y direction side surface 75 c of the terminal main body portion 71, thefirst side surface portion 76 protrudes further outward in a sidedirection (direction orthogonal to the Z direction) than the second sidesurface portion 78. At each of the +X direction side surface 75 f andthe +Y direction side surface 75 c of the terminal main body portion 71,the joining portion 77 extends from the second side surface portion 78toward the first side surface portion 76 while expanding outwardgradually in the side direction and connects the second side surfaceportion 78 and the first side surface portion 76.

The first side surface portion 76 of the +X direction side surface 75 fand the first side surface portion 76 of the +Y direction side surface75 c of the terminal main body portion 71 are respectively substantiallyflush with the +X direction side surface 9 f and the +Y direction sidesurface 9 c of the sealing resin 9 and are exposed from the +X directionside surface 9 f and the +Y direction side surface 9 c. That is, thefirst side surface portion 76 of the +X direction side surface 75 f andthe first side surface portion 76 of the +Y direction side surface 75 cof the terminal main body portion 71 constitute second exposed surfacesof the second gate terminal 7 that are continuous to the first exposedsurface. An angle portion formed by intersection of the two first sidesurface portions 76 of the terminal main body portion 71 and angleportions formed by intersections of the respective first side surfaceportions 76 and the lower surface 73 are also exposed from the sealingresin 9.

The terminal detachment restraining portion 72 is formed such as toprotrude outward in side directions from upper portions of the −Xdirection side surface 75 d and the −Y direction side surface 75 e ofthe terminal main body portion 71. An upper surface of the terminaldetachment restraining portion 72 is flush with the upper surface 74 ofthe terminal main body portion 71.

At the −X direction side surface 75 d and the −Y direction side surface75 e of the terminal main body portion 71, a side surface portion 79,between a lower edge of the terminal detachment restraining portion 72and a lower edge of the terminal main body portion 71, extends whilenarrowing gradually inward in side directions from the lower edge of theterminal detachment restraining portion 72 to the lower edge of theterminal main body portion 71 and connects the lower edge of theterminal detachment restraining portion 72 and the lower edge of theterminal main body portion 71. A height position of the lower edge ofthe terminal detachment restraining portion 72 is further to the upperside (+Z direction side) by just h1 than height positions of upper endsof the first side surface portions 76 of the +X direction side surface75 f and the +Y direction side surface 75 c of the terminal main bodyportion 71.

One end of the fourth bonding wire 14 is connected to the upper surface74 of the terminal main body portion 71 within the upper surface of thefirst gate terminal 7 (including the upper surface 74 of the terminalmain body portion 71 and the upper surface of the terminal detachmentrestraining portion 72).

A solder plating layer (not shown) 97, arranged to increase solderwettability, is formed on the lower surface 73 of the terminal main bodyportion 71 exposed from the lower surface 9 b of the sealing resin 9 andthe first side surface portions 76 exposed from the +X direction sidesurface 9 f and the +Y direction side surface 9 c of the sealing resin9. In FIG. 16 to FIG. 23, the lead plating layer 97 is omitted forconvenience of description.

Referring to FIG. 16, FIG. 17, FIG. 22, FIG. 23, FIG. 25, and FIG. 26,the common source terminal 8 has, integrally, a terminal main bodyportion 81 of quadratic prism shape having a quadrilateral (trapezoidal)bottom surface shape, and a terminal detachment restraining portion 82.The terminal main body portion 81 has a lower surface 83, an uppersurface 84, positioned at an opposite side to the lower surface 83, andfour side surfaces, connecting the lower surface 83 and the uppersurface 84. The four side surfaces are constituted of a +Y directionside surface 85 c, a −X direction side surface 85 d, a −Y direction sidesurface 85 e, and a +X direction side surface 85 f.

The +Y direction side surface 85 c is parallel to the X direction inplan view. The −X direction side surface 85 d extends in the −Ydirection and obliquely toward the +X direction from a −X direction sideedge portion of the +Y direction side surface 85 c in plan view. The +Xdirection side surface 85 f extends in the −Y direction and obliquelytoward the −X direction from a +X direction side edge portion of the +Ydirection side surface 85 c in plan view. The −Y direction side surface85 e connects a −Y direction side edge portion of the −X direction sidesurface 85 d and a −Y direction side edge portion of the +X directionside surface 85 f in plan view. Each of a connection portion of the −Xdirection side surface 85 d and the −Y direction side surface 85 e and aconnection portion of the +X direction side surface 85 f and the −Ydirection side surface 85 e is formed to a curved surface 85 gprojecting outward of the terminal main body portion 81.

The lower surface 83 of the terminal main body portion 81 issubstantially flush with the lower surface 9 b of the sealing resin 9and is exposed from the lower surface 9 b. That is, the lower surface 83of the terminal main body portion 81 constitutes a first exposed surfaceof the common source terminal 8. In bottom view (plan view), theterminal main body portion 81 is disposed at a front side centralportion of the lower surface 9 b of the sealing resin 9. Morespecifically, in bottom view, the terminal main body portion 81 isdisposed in an orientation where, a side, among four sides of the lowersurface 83 of the terminal main body portion 81, that corresponds to alower edge of the +Y direction side surface 85 c is substantiallyparallel to a side, among the four sides of the lower surface 9 b of thesealing resin 9, that corresponds to the lower edge of +Y direction sidesurface 9 c.

That is, the lower surface (first exposed surface) 83 of the terminalmain body portion 81 is, in plan view, of a quadrilateral shape having afirst side, matching a side of the lower surface 9 b of the sealingresin 9 corresponding to the lower edge of the +Y direction side surface9 c, a second side (lower edge of the −X direction side surface 85 d)and a third side (lower edge of the +X direction side surface 85 f) withrespective one ends connected to respective ends of the first side, anda fourth side (lower edge of the −Y direction side surface 85 e)connecting another end of the second side and another end of the thirdside. A connection portion of the second side and the fourth side and aconnection portion of the third side and the fourth side are formed tocurved shapes projecting outward of the lower surface (first exposedsurface) 83 of the terminal main body portion 81.

Among the four side surfaces 85 of the terminal main body portion 81,the +Y direction side surface 85 c has a first side surface portion 86,a second side surface portion 88, and a joining portion 87. The firstside surface portion 86 is continuous to the lower surface 83 andextends substantially perpendicularly toward the upper surface 84. Thesecond side surface portion 88 is continuous to the upper surface 84 andextends substantially perpendicularly toward the lower surface 83. Thefirst side surface portion 86 protrudes further outward in a sidedirection (direction orthogonal to the Z direction) than the second sidesurface portion 88. The joining portion 87 extends from the second sidesurface portion 88 toward the first side surface portion 86 whileexpanding outward gradually in the side direction and connects thesecond side surface portion 88 and the first side surface portion 86.

The first side surface portion 86 of the +Y direction side surface 85 cof the terminal main body 81 is substantially flush with the +Ydirection side surface 9 c of the sealing resin 9 and is exposed fromthe +Y direction side surface 9 c. That is, the first side surfaceportion 86 of the +Y direction side surface 85 c of the terminal mainbody portion 81 constitutes a second exposed surface of the commonsource terminal 8 that is continuous to the first exposed surface. Anangle portion formed by intersection of the first side surface portion86 of the terminal main body portion 81 and the lower surface 83 is alsoexposed from the sealing resin 9.

The terminal detachment restraining portion 82 is formed such as toprotrude outward in side directions from upper portions of the −Xdirection side surface 85 d, the −Y direction side surface 85 e, and the+X direction side surface 85 f of the terminal main body portion 81. Anupper surface of the terminal detachment restraining portion 82 is flushwith the upper surface 84 of the terminal main body portion 81.

At the −X direction side surface 85 d, the −Y direction side surface 85e, and the +X direction side surface 85 f of the terminal main bodyportion 81, a side surface portion 89, between a lower edge of theterminal detachment restraining portion 82 and a lower edge of theterminal main body portion 81, extends while narrowing gradually inwardin side directions from the lower edge of the terminal detachmentrestraining portion 82 to the lower edge of the terminal main bodyportion 81 and connects the lower edge of the terminal detachmentrestraining portion 82 and the lower edge of the terminal main bodyportion 81. A height position of the lower edge of the terminaldetachment restraining portion 82 is further to the upper side (+Zdirection side) by just h1 than a height position of an upper end of thefirst side surface portions 86 of the +Y direction side surface 85 c ofthe terminal main body portion 81.

One ends of the first bonding wire 11 and the third bonding wire 13 areconnected to the upper surface 84 of the terminal main body portion 81within the upper surface of the common source terminal 8 (including theupper surface 84 of the terminal main body portion 81 and the uppersurface of the terminal detachment restraining portion 82).

A solder plating layer 98, arranged to increase solder wettability, isformed on the lower surface 83 of the terminal main body portion 81exposed from the lower surface 9 b of the sealing resin 9 and the firstside surface portion 86 exposed from the +Y direction side surface 9 cof the sealing resin 9. In FIG. 16 to FIG. 23, the lead plating layer 98is omitted for convenience of description.

In a state where the respective terminals 4, 5, 6, 7, and 8 areresin-sealed together with the first semiconductor chip 2 and the secondsemiconductor chip 3, the sealing resin 9 extends around to below therespective terminal detachment restraining portions 42, 52, 62, 72, and82, thus preventing detachment of the respective terminals 4, 5, 6, 7,and 8 from the sealing resin 9.

Referring to FIG. 23, in the present preferred embodiment, in plan view,Y-direction distances between each of a connection point of the wire 12at the first gate terminal 5, a connection point of the wire 11 at thecommon source terminal 8, a connection point of the wire 13 at thecommon source terminal 8, and a connection point of the wire 14 at thesecond gate terminal 7 and the +Y direction side surface 9 c of thesealing resin 9 are all equal.

Also, in regard to the X direction, a connection point of the wire 12and a connection point of the wire 11 at the first semiconductor chip 2and a connection point of the wire 13 and a connection point of the wire14 at the second semiconductor chip 3 are positioned between theconnection point of the wire 12 at the first gate terminal 5 and theconnection point of the wire 14 at the second gate terminal 7.

Also, in regard to the X direction, the connection point of the wire 12at the first gate terminal 5 is positioned in an interval from a −Xdirection end to a +X direction end of the first semiconductor chip 2.On the other hand, in regard to the X direction, the connection point ofthe wire 11 at the common source terminal 8 is positioned further to a+X direction side than the +X direction end of the first semiconductorchip 2.

Similarly, in regard to the X direction, the connection point of thewire 14 at the second gate terminal 7 is positioned in an interval froma −X direction end to a +X direction end of the second semiconductorchip 3. On the other hand, in regard to the X direction, the connectionpoint of the wire 13 at the common source terminal 8 is positionedfurther to a −X direction side than the −X direction end of the secondsemiconductor chip 3.

Also, an X direction distance between the connection point of the wire11 at the common source terminal 8 and the connection point of the wire13 at the common source terminal 8 is shorter than an X directiondistance between the connection point of the wire 12 at the first gateterminal 5 and the connection point of the wire 11 at the common sourceterminal 8. Similarly, an X direction distance between the connectionpoint of the wire 11 at the common source terminal 8 and the connectionpoint of the wire 13 at the common source terminal 8 is shorter than anX direction distance between the connection point of the wire 14 at thesecond gate terminal 7 and the connection point of the wire 13 at thecommon source terminal 8.

Referring to FIG. 22, the lower surface 9 b of the sealing resin 9 has a+Y direction side 10 c, a −X direction side 10 d, a −Y direction side 10e, and a +X direction side 10 f corresponding respectively to the +Ydirection side surface 9 c, the −X direction side surface 9 d, the −Ydirection side surface 9 e, and the +X direction side surface 9 f. Inthe present preferred embodiment, in bottom view, a shape of the lowersurface 43 of the first drain terminal 4 and a shape of the lowersurface 63 of the second drain terminal 6 are line symmetrical withrespect to a virtual line passing through a center of an X-direction gapbetween these surfaces and extending in the Y direction. Also, a shapeof the lower surface 53 of the first gate terminal 5 and a shape of thelower surface 73 of the second gate terminal 7 are line symmetrical withrespect to a virtual line passing through a center of an X-direction gapbetween these surfaces and extending in the Y direction.

Let a length of the +Y direction side 10 c (−Y direction side 10 e) ofthe lower surface 9 b of the sealing resin 9 be L and a length of the −Xdirection side 10 d (+X direction side 10 f) be W. Let a length in the Xdirection of each of a side of the lower surface 43 of the first drainterminal 4 corresponding to the −Y direction side surface 45 e and aside of the lower surface 63 of the second drain terminal 6corresponding to the −Y direction side surface 65 e be LD1. Let a lengthin the Y direction of each of a side of the lower surface 43 of thefirst drain terminal 4 corresponding to the −X direction side surface 45d and a side of the lower surface 63 of the second drain terminal 6corresponding to the +X direction side surface 65 f be LD2.

Let a length in the X direction of each of a side of the lower surface53 of the first gate terminal 5 corresponding to the +Y direction sidesurface 55 c and a side of the lower surface 73 of the second gateterminal 7 corresponding to the +Y direction side surface 75 c be LG1.Let a length in the Y direction of each of a side of the lower surface53 of the first gate terminal 5 corresponding to the −X direction sidesurface 55 d and a side of the lower surface 73 of the second gateterminal 7 corresponding to the +X direction side surface 75 f be LG2.Let an X-direction length of a side of the lower surface 83 of thecommon source terminal 8 corresponding to the +Y direction side surface85 c be LS1. Let a Y-direction length of the lower surface 83 of thecommon source terminal 8 be LS2.

Let an X-direction interval between the side of the lower surface 43 ofthe first drain terminal 4 corresponding to the −Y direction sidesurface 45 e and the side of the lower surface 63 of the second drainterminal 6 corresponding to the −Y direction side surface 65 e be d1.Let an X-direction interval between the side of the lower surface 53 ofthe first gate terminal 5 corresponding to the +Y direction side surface55 c and the side of the lower surface 83 of the common source terminal8 corresponding to the +Y direction side surface 85 c be d2.

Let an X-direction interval between the side of the lower surface 73 ofthe second gate terminal 7 corresponding to the +Y direction sidesurface 75 c and the side of the lower surface 83 of the common sourceterminal 8 corresponding to the +Y direction side surface 85 c be d3.Let a Y-direction interval between the side of the lower surface 43 ofthe first drain terminal 4 corresponding to the −X direction sidesurface 45 d and the side of the lower surface 53 of the first gateterminal 5 corresponding to the −X direction side surface 55 d be d4.Let a Y-direction interval between the side of the lower surface 63 ofthe second drain terminal 6 corresponding to the +X direction sidesurface 65 f and the side of the lower surface 73 of the second gateterminal 7 corresponding to the +X direction side surface 75 f be d5.

The semiconductor device 1 preferably satisfies the following formulae(7) and (8).d1=d2=d3=d4=d5  (7)LS2=LG2  (8)

The semiconductor device 1 preferably further satisfies the followingformulae (9), (10), (11), and (12).LS1=d1  (9)LD2=LD1  (10)LG2=LG1  (11)LD1>LG1  (12)

In the present preferred embodiment, LS1, LS2, LG1, LG2, LS1, LS2, andd1 to d5 are set to satisfy the formulae (7) to (12).

Specifically, in the present preferred embodiment, LS1, LS2, LG1, LG2,LS1, LS2, and d1 to d5 are set to the following lengths.LD1=LD2=0.3=LG1=LG2=LS2=0.1=d1=d2=d3=d4=d5=LS1=0.2 mm

For efficient dissipation of the heat of the semiconductor chips 2 and3, it is better for areas of the lower surfaces 43 and 63 of the drainterminals 4 and 6 to be larger. However if the areas of the lowersurfaces 43 and 63 of the drain terminals 4 and 6 are increased, thesemiconductor device 1A increases in size. In the present preferredembodiment, to miniaturize the semiconductor device 1A, sizes of thelower surfaces 43 and 63 of the drain terminals 4 and 6 are set to theminimum necessary sizes for heat dissipation of the semiconductor chips2 and 3. Specifically, the lengths LD1 and LD2 of the two sides of thelower surfaces 43 and 63 of the drain terminals 4 and 6 are set to 0.3mm.

The one ends of the bonding wires 12 and 14 are connected to the uppersurfaces 54 and 74 of the gate terminals 5 and 7. In the presentpreferred embodiment, in order to miniaturize the semiconductor device1A, sizes of the upper surfaces 54 and 74 of the gate terminals 5 and 7are set to the minimum necessary sizes for connecting the one ends ofthe bonding wires 12 and 14. Specifically, the lengths LG1 and LG2 ofthe two sides of the upper surfaces 54 and 74 of the gate terminals 5and 7 are set to 0.1 mm.

As shall be described below, in mounting the semiconductor device 1A ona mounting substrate 201 (see FIG. 12 and FIG. 13), the lower surfaces43, 53, 63, 73, and 83 (more accurately, the lead plating layers 94, 95,96, 97, and 98) of the respective terminals 4, 5, 6, 7, and 8 are coatedwith solder 211. In this process, a measure must be taken to preventmutual contact of the solder coated on the lower surfaces of theterminals 4 to 8 (more accurately, the lead plating layers 94 to 98)that are adjacent. In the present preferred embodiment, in order tominiaturize the semiconductor device 1A, the intervals between theterminals 4 to 8 that are adjacent are set to the minimum necessaryintervals for preventing mutual contact of the solder coated on theterminals 4 to 8 (more accurately, the lead plating layers 94 to 98)that are adjacent. Specifically, the intervals d1 to d5 between theterminals 4 to 8 that are adjacent are set to 0.2 mm.

To acquire such intervals d1 to d5, the X-direction length LS1 and theY-direction LS2 of the lower surface 83 of the common source terminal 8are set to 0.2 mm and 0.1 mm, respectively.

That is, in the present preferred embodiment, the length L of thesemiconductor device 1A is 0.8 mm (=0.3 mm+0.2 mm+0.3 mm). The width Wof the semiconductor device 1A is 0.6 mm (=0.1 mm+0.2 mm+0.3 mm). Aheight H (see FIG. 20 and FIG. 21) of the semiconductor device 1A is0.36 mm. Also, a height h (see FIG. 20 and FIG. 21) of each of the firstside surface portions 46, 56, 66, 76, and 86 of the respective terminals4, 5, 6, 7, and 8 exposed from the side surfaces 9 c to 9 f of thesealing resin 9 is 0.06 mm. The abovementioned dimensions of therespective portions are but an example and are not restricted thereto.

FIG. 27 and FIG. 28 are illustrative sectional views of a mounted stateof the semiconductor device 1A. FIG. 27 is a sectional viewcorresponding to FIG. 24, and FIG. 28 is a sectional view correspondingto FIG. 25.

The semiconductor device 1A is mounted on a surface of the mountingsubstrate (wiring substrate) 201. A first drain terminal land 204, afirst gate terminal land 205, a second drain terminal land 206, a secondgate terminal land 207, and a common source terminal land 208 are formedon the surface 202 of the mounting substrate 201.

To mount the semiconductor device 1A on the mounting substrate 201,first, the solder 211 that is creamy is coated on surfaces of therespective lands 204 to 208 on the mounting substrate 201. Next, thesemiconductor device 1A is placed on the lands 204 to 208 in anorientation such that the lower surface 43 of the terminal 4, the lowersurface 53 of the terminal 5, the lower surface 63 of the terminal 6,the lower surface 73 of the terminal 7, and the lower surface 83 of theterminal 8 of the semiconductor device 1A face the lands 204, 205, 206,207, and 208, respectively, on the mounting substrate 201.

Next, the semiconductor device 1A, in a state of being pressed againstthe lands 204 to 208 of the mounting substrate 201, is heated for afixed time and thereafter cooled. The terminals 4, 5, 6, 7, and 8 of thesemiconductor device 1A are thereby bonded by the solder 211 to thelands 204, 205, 206, 207, and 208, respectively, on the mountingsubstrate 201.

The plating layers 94, 95, 96, 97, and 98 for increasing solderwettability are formed on the lower surfaces 43, 53, 63, 73, and 83 andthe first side surface portions 46, 56, 66, 76, and 86 of the respectiveterminals 4, 5, 6, 7, and 8. Therefore when the lower surfaces 43, 53,63, 73, and 83 of the respective terminals 4, 5, 6, 7, and 8 becomebonded to the cream solder 211 on the respective lands 204, 205, 206,207, and 208, the cream solder 211 closely adheres, so as to creep up,to the first side surface portions 46, 56, 66, 76, and 86 of therespective terminals 4, 5, 6, 7, and 8. Consequently, amounting strengthof the semiconductor device 1A and the mounting substrate 201 can beimproved and connection reliability can be improved.

Also, so-called solder fillets are thereby formed on the first sidesurface portions 46, 56, 66, 76, and 86 of the respective terminals 4,5, 6, 7, and 8 and therefore bonding (soldering) states of therespective terminals 4, 5, 6, 7, and 8 and the respective lands 204,205, 206, 207, and 208 can be readily inspected visually.

With the semiconductor device 1A according to the second preferredembodiment described above, the source electrode of the firstsemiconductor chip 2 and the source electrode of the secondsemiconductor chip 3 are electrically connected to the common sourceterminal 8. Therefore there is no need to connect a source terminal ofthe first semiconductor chip 2 and a source terminal of the secondsemiconductor chip 3 at an exterior of the semiconductor device 1A inusing the semiconductor device 1A as a bidirectional switch.

Also with the semiconductor device 1A according to the second preferredembodiment described above, the respective terminals 4, 5, 6, 7, and 8have the lower surfaces (first exposed surfaces) 43, 53, 63, 73, and 83that are substantially flush with the lower surface 9 b of the sealingresin 9 and are exposed from the lower surface 9 b of the sealing resin9, and therefore miniaturization can be achieved in comparison to asemiconductor device having lead terminals projecting from an outersurface of the sealing resin 9.

Also with the semiconductor device 1A according to the second preferredembodiment described above, the respective terminals 4, 5, 6, 7, and 8have the first side surface portions (second exposed surfaces) 46, 56,66, 76, and 86 that are exposed from the side surfaces 9 c to 9 f of thesealing resin 9 and therefore confirmation of the bonding states(mounting properties) of the respective terminals 4, 5, 6, 7, and 8 andthe respective lands 204, 205, 206, 207, and 208 is made easy.

Although with the second preferred embodiment described above, therespective terminals 4, 5, 6, 7, and 8 have the first side surfaceportions (second exposed surfaces) 46, 56, 66, 76, and 86 that areexposed from the side surfaces 9 c to 9 f of the sealing resin 9, suchexposed surfaces 46, 56, 66, 76, and 86 do not have to be provided.

Also although with the second preferred embodiment described above, therespective terminals 4, 5, 6, 7, and 8 have the lower surfaces (firstexposed surfaces) 43, 53, 63, 73, and 83 that are exposed from the lowersurface 9 b of the sealing resin 9, the respective terminals 4 to 8 mayhave, in place of such exposed surfaces, upper surfaces that aresubstantially flush with the upper surface 9 a of the sealing resin 9and are exposed from the upper surface 9 a of the sealing resin 9.

Also, the first and second drain terminals 4 and 6 may have exposedsurfaces exposed from one surface among the upper surface 9 a and thelower surface 9 b of the sealing resin 9, and the first gate terminal 5,the second gate terminal 7, and the common source terminal 8 may haveexposed surfaces exposed from the other surface among the upper surface9 a and the lower surface 9 b of the sealing resin 9.

The present application corresponds to Japanese Patent Application No.2017-57831 filed in the Japan Patent Office on Mar. 23, 2017 andJapanese Patent Application No. 2017-249969 filed in the Japan PatentOffice on Dec. 26, 2017, and the entire disclosures of theseapplications are incorporated herein by reference.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing the scope andsprit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. A semiconductor device in which a semiconductorchip is sealed with a sealing resin, comprising: a first corner portion,a second corner portion adjacent to the first corner portion, a thirdcorner portion facing the first corner portion diagonally, a fourthcorner portion opposed to the second corner portion diagonally, a firstterminal disposed in the vicinity of the first corner portion forelectrically connecting to the outside, a second terminal disposed inthe vicinity of the second corner portion for electrically connecting tothe outside, a third terminal disposed in the vicinity of the fourthcorner portion for electrically connecting to the outside, and a fourthterminal disposed in the vicinity of the third corner portion forelectrically connecting to the outside, wherein an area as seen in planview of the first terminal and an area as seen in plan view of thesecond terminal are the same size, an area as seen in plan view of thethird terminal and an area as seen in plan view of the fourth terminalare the same size, the area as seen in plan view of the third terminalis larger than the area as seen in plan view of the first terminal, noterminal exists between the first terminal and the third terminal inplan view, and no terminal exists between the second terminal and thefourth terminal in plan view.
 2. The semiconductor device according toclaim 1, wherein the sealing resin has first and second side surfacesopposed to each other, the first terminal and the second terminal areexposed from one side surface of the first and second side surfaces, andthe third terminal and the fourth terminal are exposed from the otherside surface of the first and second side surfaces.
 3. The semiconductordevice according to claim 2, wherein the sealing resin has third andfourth side surfaces opposed to each other, other than the first andthird side surfaces, the first terminal and the third terminal areexposed from one side surface of third and fourth side surfaces, and thesecond terminal and the fourth terminal are exposed from the other sidesurface of the third and fourth surfaces.
 4. The semiconductor deviceaccording to claim 3, wherein the sealing resin has two opposingsurfaces, and the first terminal, the second terminal, the thirdterminal, and the fourth terminal are exposed from one surface of thetwo surfaces.
 5. The semiconductor device according to claim 4, furthercomprising a fifth terminal between the first terminal and the secondterminal for electrical connection to the outside, wherein the fifthterminal is exposed from the one side surface of the first and secondside surfaces and is exposed from one surface of the two surfaces in thesealing resin.
 6. The semiconductor device according to claim 2, furthercomprising a fifth terminal between the first terminal and the secondterminal for electrical connection to the outside, wherein the fifthterminal is exposed from the one side surface of the first and secondside surfaces.
 7. The semiconductor device according to claim 1, furthercomprising a fifth terminal between the first terminal and the secondterminal for electrical connection to the outside.
 8. The semiconductordevice according to claim 7, wherein an area as seen in plan view of thefifth terminal is larger than the area as seen in plan view of the firstterminal and smaller than the area as seen in plan view of the thirdterminal.
 9. The semiconductor device according to claim 7, wherein thesemiconductor chip includes a first semiconductor chip and a secondsemiconductor chip, the first semiconductor chip is electricallyconnected to the first terminal and the third terminal, the secondsemiconductor chip is electrically connected to the second terminal andthe fourth terminal, the first semiconductor chip and the secondsemiconductor chip are each electrically connected to the fifthterminal.
 10. The semiconductor device according to claim 9, wherein thefirst terminal is a first gate terminal for connecting the gateelectrode of the first semiconductor chip, the third terminal is a firstdrain terminal for connecting a drain electrode of the firstsemiconductor chip, the second terminal is a second gate terminal forconnecting a gate electrode of the second semiconductor chip, the fourthterminal is a second drain terminal for connecting a drain electrode ofthe second semiconductor chip, and the fifth terminal is a sourceterminal for connecting a source electrode of the first semiconductorchip and a source electrode of the second semiconductor chip.
 11. Thesemiconductor device according to claim 10, wherein the source electrodeof the first semiconductor chip is connected to the fifth terminal via afirst bonding wire, the gate electrode of the first semiconductor chipis connected to the first terminal via a second bonding wire, the drainelectrode of the first semiconductor chip is directly connected to thethird terminal, the source electrode of the second semiconductor chip isconnected to the fifth terminal via a third bonding wire, the gateelectrode of the second semiconductor chip is connected to the secondterminal via a fourth bonding wire, and the drain electrode of thesecond semiconductor chip is directly connected to the fourth terminal.12. The semiconductor device according to claim 11, wherein each of thefirst terminal, the second terminal, the third terminal, the fourthterminal, and the fifth terminal has an exposed surface exposed on onesurface of two surfaces of the sealing resin.
 13. The semiconductordevice according to claim 12, wherein the one surface of the sealingresin has a first side and a second side that are mutually opposed, athird side joining one ends of the first side and the second sidetogether, and a fourth side joining other ends of the first side and thesecond side together, the exposed surface of the first terminal isdisposed at a first corner portion at which the first side and the thirdside of the one surface are joined, the exposed surface of the secondterminal is disposed at a second corner portion at which the first sideand the fourth side of the one surface are joined, the exposed surfaceof the third terminal is disposed at a third corner portion at which thesecond side and the third side of the one surface are joined, theexposed surface of the fourth terminal is disposed at a fourth cornerportion at which the second side and the fourth side of the one surfaceare joined, and the exposed surface of the fifth terminal is disposed atan intermediate position of the one surface between the exposed surfaceof the first terminal and the exposed surface of the second terminal.14. The semiconductor device according to claim 13, wherein the exposedsurface of each terminal has a rectangular shape having four sidesparallel to the four sides of the one surface, and when, for the exposedsurface of each of the third terminal and the fourth terminal, a lengthof the side parallel to the second side is LD1 and a length of the sideparallel to the third side is LD2, and for the exposed surface of eachof the first terminal and the second terminal, a length of the side thatis parallel to the first side is LG1 and a length of the side parallelto the third side is LG2, and for the exposed surface of the fifthterminal, a length of the side that is parallel to the first side is LS1and a length of the side parallel to the third side is LS2, and aninterval, along a direction along the second side, between the exposedsurface of the third terminal and the exposed surface of the fourthterminal is d1, an interval, along a direction along the first side,between the exposed surface of the first terminal and the exposedsurface of the fifth terminal is d2, an interval, along the directionalong the first side, between the exposed surface of the second terminaland the exposed surface of the fifth terminal is d3, an interval, alonga direction along the third side, between the exposed surface of thethird terminal and the exposed surface of the first terminal is d4, andan interval, along a direction along the fourth side, between theexposed surface of the fourth terminal and the exposed surface of thesecond terminal is d5, the following formulae (a) and (b) areestablished.d1=d2=d3=d4=d5  (a)LS2=LG2  (b)
 15. The semiconductor device according to claim 14, whereinthe following formulae (c) to (f) are further established.LS1=d1  (c)LD2=LD1  (d)LG2=LG1  (e)LD1>LG1  (f)
 16. The semiconductor device according to claim 1, whereinthe semiconductor chip includes a first semiconductor chip and a secondsemiconductor chip, the first semiconductor chip is electricallyconnected to the first terminal and the third terminal, and the secondsemiconductor chip is electrically connected to the second terminal andthe fourth terminal.
 17. The semiconductor device according to claim 16,wherein a first surface side of the first semiconductor chip isconnected to the first terminal, a second surface side of the firstsemiconductor chip opposite to the first surface side is connected tothe third terminal, a first surface side of the second semiconductorchip is connected to the second terminal, and a second surface side ofthe second semiconductor chip opposite to the first surface side isconnected to the fourth terminal.
 18. The semiconductor device accordingto claim 16, wherein the first terminal is a first gate terminal forconnecting a gate electrode of the first semiconductor chip, the thirdterminal is a first drain terminal for connecting a drain electrode ofthe first semiconductor chip, the second terminal is a second gateterminal for connecting a gate electrode of the second semiconductorchip, and the fourth terminal is a second drain terminal for connectinga drain electrode of the second semiconductor chip.
 19. Thesemiconductor device according to claim 18, wherein the gate electrodeof the first semiconductor chip is connected to the first terminal via asecond bonding wire, the drain electrode of the first semiconductor chipis directly connected to the third terminal, the gate electrode of thesecond semiconductor chip is connected to the second terminal via afourth bonding wire, and the drain electrode of the second semiconductorchip is directly connected to the fourth terminal.
 20. The semiconductordevice according to claim 1, wherein an interval between the firstterminal and the second terminal is larger than an interval between thethird terminal and the fourth terminal in plan view.
 21. Thesemiconductor device according to claim 1, wherein no terminal existsbetween the third terminal and the fourth terminal in plan view.